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Evolving High Speed Connectors

Evolving High Speed Connectors

Backplane - Midplane And Cable Assemblies 3 to 20+ Gb/s
This recent research report provides a complete analysis of Evolving High-Speed Connectors and details backplane, midplane, and high-speed backplane cable assemblies. Connector values are provided for each category for the years 2007, 2008, 2009, and 2013, as well as region of the world.
Connectors designed to operate in multi-gigabit applications have proliferated over the past four years providing system designers greatly expanded interconnect options and performance levels. Advances in connector as well as signal conditioning technology have pushed interface bandwidth from 3 Gb/s to 20+ Gb/s, with at least one supplier introducing a 40 Gb backplane connector. This market research report addresses the many aspects of the high-speed interconnect market from what is driving demand for faster channels, to defining the key characteristics of the leading connector families that are currently available. Detailed market estimates and forecasts extending to 2013 for backplane and cable connectors by application and region of the world are featured.
A variety of factors associated with high-speed channels have a major influence on their behavior. Chapters are devoted to reviewing related system elements including driver and receiver technology, printed circuit board materials, as well as channel modeling, and performance measurement systems.
A new chapter focused on innovation provides examples of new creative approaches to addressing some of the challenges associated with interconnection and packaging of next generation electronic equipment.
This market research report also includes several tutorial chapters on connector and high-speed design issues that enable a non-technical reader to gain from the information provided.
Bandwidth demands are increasing resulting in greater challenges to satisfying signal integrity requirements. At the same time packaging density puts more contacts in closer proximity to each other creating potential for increased crosstalk and signal degradation.
Systems consume more power that generates more heat. Connectors must be designed to support power / thermal management schemes.
Emerging standards such as the Intel Quick-Path Interconnect are driving changes in both current as well as future high-speed connectors and have implications for every element in the channel.
High-speed copper cable assemblies that incorporate passive or active equalization techniques are expanding the anticipated practical bandwidth and length limitations of just a few years ago.
Designing 6 Gb/s channels is not a trivial issue, causing engineers to rely on their chosen connector vendor to provide extensive selection and design support 24/7 on a global basis.
Connector manufacturers are working closely with suppliers of driver and receiver chips to demonstrate performance in faster and longer channels.
Connector Market
Connector users want a clear performance migration path to support, anticipated bandwidth needs of their next generation equipment. This is driving connector manufacturers to provide multi-tiered product families that can enable product upgrades without changing product families or even PCB circuit layout.
Reliance on a single source for critical components is no longer acceptable. High-speed connector manufacturers have responded by cross-licensing many of their flagship product families to product mechanically and electrically identical interfaces. This process has allowed each supplier to offer a broad range of products at market driven prices.
The market has stratified with a select group of highly competitive connector suppliers offering a full range of state-of-the-art interconnects. A secondary tier is focused on supporting individual segments of the market that requires less technical resources and / or may offer a quicker return on investment.
The pace of new connector induction has been exceptional over the past two years, with more products in the development pipeline. Many of these new interfaces are benefiting from better understanding of the behavior of high-speed signals resulting in the refinement of the connector and its PCB launch.
This market research report is the third in a continuing series of investigations of this highly dynamic product segment. The advancement of this technology together with experience gained in designing these unique interfaces may set the stage for the evolution of all types of next generation electronic connectors. Those suppliers who have consistently made the necessary investment in resources to develop this expertise may emerge as the only viable suppliers capable of supporting future application requirements.

  • Chapter 1 - Report Scope And Methodology
    • Report Scope And Methodology
    • Methodology and Approach
    • Connector Manufacturer Survey
    • Users Survey
  • Chapter 2 - Introduction And Definitions
    • Preface
    • Introduction
  • Chapter 3 - High Speed Connector Basics
    • High Speed Connector Basics
    • Common Backplane Architecture
    • Midplane Architecture
    • Orthogonal Midplane Architecture
    • High-Speed Transmission Line Issues
    • Defining Features of High-Speed Interfaces
    • Connector Selection Criteria
    • Bandwidth Rating of Connectors
    • The Second Sourcing Imperative
    • Performance Measurement Systems
    • Test and Analysis Equipment
    • Comparison of Electrical Performance
    • Design Support Provided by Connector Manufacturers
  • Chapter 4 - The Need For Speed
    • The Need For Speed
    • Market Drivers to Higher Speed Interfaces
    • Speed Versus Density
    • The Influence of Industry Standards
  • Chapter 5 - High Speed Interconnect System Elements
    • High-Speed Interconnect System Elements
    • Driver and Receiver Technology
    • Printed Circuit Board Materials
    • Printed Circuit Board Design and Fabrication
  • Chapter 6 - High-Speed Connector And Market Trends, 2006-2008
    • High-Speed Connector And Market Trends 2006-2008
    • High-Speed Backplane Connector Families
  • Chapter 7 - Overview Of Current High-Speed Backplane / Midplane Connectors
    • Overview Of Current High-Speed Backplane / Midplane Connectors
    • Amphenol TCS
    • VHDM, VHDM-HSD, VHDM H-Series, e-HSD, GbX, Ventura, Aptera, Crossbow, XCede, VIPER
    • ERNI Components
    • ERmetZD, ERmet zero XT and ERmetZD plus
    • FCI Electronics
    • Metral 4000®, AirMax VS®, ZipLine™
    • 3M Electronic Solutions Division
    • HSHM, UHM
    • Molex
    • VHDM / VHDM-HSD, GbX, GbX I-Trac, Impact, EdgeLine
    • Tyco Electronics
    • Z-Pack HS3, Z-PACK™ HM-Zd, Z-PACK™ HM-Zd+, TinMan, TinMan+ MultiGig RT, Z-Pack Slim UHD, STRADA Whisper
  • Chapter 8 - High-Speed Copper Connector And Cable Assemblies
    • High-Speed Copper Cable Connectors And Assemblies
    • Bringing Cable To The Backplane
    • Cable Assembly Construction
    • High-Speed Cable Assembly Types
    • Typical Applications
  • Chapter 9 - Overview Of Selected High-Speed Copper Backplane Cable Assembly Suppliers
    • Overview Of Selected High-Speed Backplane Cable Assembly Suppliers
    • W.L. Gore & Associates
    • Meritec
    • Molex
    • Samtec
    • Sanmina-SCI
    • Carlisle Interconnect Technologies
    • FCI Electronics
    • Tyco Electronics
    • Amphenol InterCon Systems
    • 3M Electro Communications Business Group
    • LEONI
  • Chapter 10 - Backplane And Cable Connector Design Feature Backplane And Cable Connector Design Feature
    • Introduction
    • Backplane Connector Design Features
    • Amphenol TCS
    • Amphenol ABS
    • ERNI Electronics
    • FCI Electronics
    • Molex
    • Tyco Electronics
    • 3M
  • Chapter 11 - Market Analysis / Forecasts
    • Market Analysis - Forecast
    • Measurement Criteria
    • World Connector Market
    • High-Speed Backplane & Midplane Connectors
    • Market Forecast by World Region
    • High-Speed Backplane & Midplane Connectors
    • World Market - End User Forecast
    • High Speed Backplane & Midplane Connectors
    • World Market Forecast
    • High-Speed Copper Cable Assemblies
    • Market Forecast by World Region
    • 3- 12+ Gb/s Copper Cable Assemblies
    • World Market - End User Forecast
    • High Speed Copper Cable Assemblies
  • Chapter 12 - High-Speed Connector Innovation
    • High-Speed Connector Innovation
    • Introduction
  • Chapter 13 - Major Findings And Conclusions
    • Major Findings And Conclusions
    • General
    • Backplane Connectors
    • Midplane Connectors
    • High-Speed Cable Connectors and Assemblies
    • o Appendix A - Terms And Definitions
    • o Appendix B - List Of Contributors
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