IPD - 2009 Report (Technologies, Applications, Markets & Players)

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPD's) are now a growing industry trend driven by RF, High Brightness LEDs, Digital & Mixed Signal applications.

Yole's new research study on Thin-film Integrated Passive and Active devices estimates the total IPD market to grow from more than $600M this year to over $1B by 2013. Whether it is to reduce space on the application board, to enhance performance or to reduce cost at the system level, IPD's are spreading to most electronic sectors, from low volume to mass market businesses in aerospace, military, medical, industrial, lighting, communications, and PC applications.

Over the past few years, IPD's have become an essential enabler of System-in-Packages (SiP) realizations. Looking to tomorrow, IPD's are paving the way to the bright future of the ""More than Moore"" heterogeneous integration as they contribute greatly to bridging the increasing gap between the evershrinking geometries of CMOS IC's and the lagging packaging technologies. IPD's enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units and digital processors.

At the frontier between the back-end and the front-end of the semiconductor industry, Thin-film IPD's are poised to extend the use of Wafer-Level Packaging (WLP) and Through silicon Via (TSV) technology platforms to many IC package solutions as well as to the discrete passive component industry.

Being a bridge platform, IPD's involve the complete semiconductor value chain: equipment; material providers; fabless semiconductor players; integrated device manufacturers; CMOS foundries; MEMS players; substrate suppliers; and OSAT industry, are all concerned by the need to increase their value proposition in the future through the extensive integration of thin film integrated passive and active devices. In this report, you will find comprehensive links between the different IPD technologies and each of their applications. Market share, supply value chain and strategies of the current major players and those looking at entering this business have been identified.

IPD technology trends, manufacturing options and challenges to be addressed are discussed and detailed. Finally, a complete market segmentation for the commercialization of IPD's is proposed.

Market forecasts and attached growth rates for each segment are provided for 2008-2015.

KEY FEATURES OF THE STUDY

• Four application fields investigated (ESD/EMI protection, HB-LED silicon submounts, RF and Digital & Mixed signal IPD)
• Market trends and figures provided both in M$, Munits and wafer size equivalent
• Complete technologies and material tool-box analysis
• 30 detailed company profiles of key IPD players
• 320+ pages This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report not only describes the market and the associated technologies deep inside the applications, but it also provides a broad overview of the thin-film IPD market and its forthcoming growth opportunities.

Each market sub-segment is exhaustively detailed with:

• Drivers and benefits of IPDs
• Sub-segment size and expected growth rate
• Value chain analysis
• Global market evaluation per application: volume in units, wafers, and market size ($).
• Evaluation of the major market players (market share)

Companies cited in the report

AMD, ATI, Amkor, Analog Devices, Apple, apm, ASE, Avago, AVX, Bourns, Bridgelux, CMD, Cree, CSR, Kyocera, Fairchild, Flip-Chip International, Fraunhofer Institutes, Freescale, Fujikura, Hymite, Ibiden IBM, IMEC, Infineon, ipdia, Ibiden, IME, IMEC, ITRI, Jazz Semiconductor, KST-World, Qualcomm, Leti, LG Innotek, Lumileds, Maxim IC, Micron, Murata / SyChip, National Semiconductor, Nichia, NEPES, Nokia, NXP, OnChip Devices, On Semiconductor, Paratek, RFMD, Shinko, Silex Microsystems, Skyworks, Semtech, STATSChipPAC, STMicroelectronics, SPIL, Telephus / SEMCO, Taiyo Yuden, Texas Instruments, Thales, Touch Microsystems Technology, Toshiba, Triquint, Tyndall, UMC, Vishay, Wavenics, Wispry, Zarlink and more...