Plastics in Electronic Components

Publication Date	September 2006
Publisher	BCC Research
Product Type	Report
Pages	200
ISBN Number
Product Code	BCC00074

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Summary

This study focuses on plastics usage in the electronics industry. It is not a review of the entire electronics industry but deals with development of resins and resin grades to meet requirements of electronic technologies related to computers, telecommunications, automotive, and other major industries employing electronic components.

Scope Of Study

This report contains: A detailed market overview of plastics in electronic components, specifically covering resins and resin grades to meet requirements of electronic technologies related to computers, telecommunications, automotive, and other industries employing electronic components
An analysis of the North American market and its upcoming trends, with detailed tables and a five-year forecast through 2011
An examination of technological trends in the market, both recent and forthcoming
A detailed list of profiles for the top contributors in the industry as well as a detailed patent analysis.

Report Highlights

Thermoplastic and thermoset volumes, estimated at slightly over 586 million pounds in 2006 should reach over 700 million pounds by 2011 corresponding to an annual growth rate of 4.3%.
Thermoplastics will have the highest growth rate through the forecast period at 4.8%. Consumption is almost 400 million pounds in 2006 and should grow to just over 500 million pounds in 2011.
In terms of technology driven factors, miniaturization is still an important factor, although it is beginning to reach its saturation point; thinwalling of molded parts; and higher soldering temperatures due to surface mount technologies (SMT) and lead-free soldering have been some of the key parameters affecting choices and volumes of plastics being used to mold components. These factors will drive the use for resins with higher heat deflection temperatures (HDTs) and glass transition temperatures (Tgs) and lower dielectric constants.

Content

Introduction
- Objectives
- Scope And Format
- Reasons For Doing The Study
- Methodology
- Acronyms
- About The Author
- Related BCC Publications
- BCC Online Services
- Disclaimer
Executive Summary
- Summary Table: North American Consumption In Electronic Components By Type Of Resin, Through 2011 (Million Pounds)
- Summary Figure: North American Consumption In Electronic Components By Type Of Resin, 2005-2011 (Million Pounds)
Resins Used In Electronic Components
- Thermoplastics
  - Nylons
    - Background
    - Properties
    - Major Types
    - Nylon 66
    - Nylon 6
    - Similarities And Difference Between Properties Of Nylon 6 And Nylon 66
    - Other Nylons
    - Overview
    - Nylon 46
    - Reinforced Nylons
    - Processing
    - Electric/Electronic Applications
    - Producers And Capacities
    - Recent Developments
    - Basf Buys Honeywell's Nylons
    - Kuraray High-Temperature Nylons
    - Ems-Grivory's New Nylons
    - Bayer's Reinforced Nylons
    - Dupont's Reinforced Nylons
    - Dsm Nylons For Connectors
    - Degussa Nylons For Connectors
    - Market Estimates And Forecasts
  - Thermoplastic Polyesters
    - Background
    - Polybutylene Terephthalate (PBT)
    - Background
    - Properties
    - Applications
    - Producers
    - New Developments And Products
    - Basf
    - Cyclics Corporation
    - Bayer Corporation
    - Ticona Corporation
    - Degussa
    - Polyethylene Terephthalate (PET)
    - Overview
    - Properties And Grades
    - Electronic/Electrical Applications
    - Producers And Capacities
    - New Developments
    - Pet And Pbt Competitive Scenario
    - Polycyclohexyldimethylene Terephthalate (PCT)
    - Background
    - Properties
    - Producers And Applications
    - New Developments
    - Pct Usage In Automotive Connectors
    - New Resins For Mids
    - Market Estimates And Forecasts
  - Polyphenylene Sulfide (PPS)
    - Background
    - Properties
    - Advantages And Disadvantages
    - Applications
    - Producers
    - Other Technology Considerations
    - Market Estimates And Forecasts
  - Polyimides/ Pei/ Pai
    - Background
    - Properties
    - Early E/E Applications
    - Vespel Parts
    - A Major Electric/Electronic Application - Dielectric Interlayers
    - Polyimide Films
    - Polyetherimides (PEIS)
    - Background
    - Properties
    - Applications
    - Polyamideimides (PAIS)
    - Background
    - Properties
    - Applications
    - Producers
    - New Developments
    - Ge Plastics
    - Dupont
    - Market Estimates And Forecasts
  - Polycarbonates
    - Background
    - General Grades
    - Properties
    - Overview
    - Property Advantages And Disadvantages
    - Polyester Carbonates
    - Applications
    - Marketing
    - Producers And Capacities
    - Market Estimates And Forecasts
  - Polyphthalamides (PPA)
    - Background
    - Properties And Applications
    - Producers
    - Market Estimates And Forecasts
  - Liquid Crystal Polymers (LCP)
    - Background
    - Properties
    - Applications
    - Background
    - Electrical/ Electronics
    - Producers
    - New Developments And Products
    - Ticona
    - Dupont
    - Market Estimates And Forecasts
  - Total
  - Polysulfones
    - Background
    - Types Of Polysulfones
    - Background
    - Polyethersulfones (PES)
    - Polyarylsulfones
    - Grades
    - Properties
    - Applications Of Polysulfones
    - Electrical/Electronic Applications
    - Producer Scenario
    - Market Estimates And Forecasts
  - Alloys/Blends
    - Background
    - Ppo/Hips
    - Background
    - Properties
    - Applications
    - Ppo/Nylon
    - Background And Properties
    - Grades And Applications
    - Pei/Polycarbonate Blends
    - Lcp/Pps Alloys
    - Recent Alloy/Blend Developments
    - Compatibilizer Advances
    - Lcp Teams Up With Polycarbonates And Pet
    - Use Of Pc/Pbt Blends
    - Market Estimates And Forecasts
  - Fluoropolymers
    - Background
    - Properties And Applications
    - Producers
    - Market Estimates And Forecasts
  - Polyketones
    - Background
    - Properties
    - Applications
    - Producers
    - Recent Developments
    - Degussa
    - Victrex, Ltd.
    - Asian Sources For Peek
    - Peek For Lead-Free Soldering
    - Peek For Thin-Wall Parts
    - Market Estimates And Forecasts
  - Thermoplastic Market Estimates And Forecasts Summary
- Thermoset Resins
  - Overview
  - Reinforced Grades
  - General Properties
  - Epoxy Resins
    - Overview
    - Background
    - Chemical Epoxy Types
    - Technology And Properties
    - Electronic Applications
    - Epoxy Systems
    - Background
    - Non-Molded
    - Laminating Systems
    - Molded Epoxies
    - Producers
    - Market Estimates And Forecasts
  - Polyurethanes
    - Background
    - General Applications
    - Market Estimates And Forecasts
  - Phenolics
    - Background
    - Grades
    - Molding Compounds
    - Background
    - Typical Applications For Phenolic Molding Compounds
    - Electric/Electronic Applications
    - Producers
    - Market Estimates And Forecasts
  - Unsaturated Polyesters
    - Background
    - Ingredients Of Unsaturated Polyester Formulations
    - Applications
    - Construction
    - Bathroom Products
    - Corrosion-Resistant Products
    - Marine Products
    - Transportation
    - Other Applications
    - Electrical/Electronic
    - Bulk Molding Compounds (BMC)
    - Background
    - Applications
    - Producers And Suppliers
    - Market Estimates And Forecasts
  - Diallyl Phthalate (DAP)
    - Overview
    - Background And Applications
    - Producers
    - Market Estimates And Forecasts
  - Thermoset Market Estimate And Forecast Summary
Electronic Component Products
- Introduction
- Active Devices
- Active/Passive Devices
- Passive Devices
- Focus Of This Report
- Dielectric Properties Of Plastics
  - Overview
  - Background
- Printed Circuit Boards (PCBS)
  - Background
  - Overview
  - Property Requirements
    - Electrical
    - Mechanical
    - Other Property Requirements
  - Technologies
    - Overview
  - Pcb Substrates
    - Overview
    - Rigid Substrates
    - Overview
    - Current Material Usage
    - Standard Fr-4 Epoxy Resin
    - Higher-Performance Epoxies
    - Polyimides
    - Cyanate Esters
    - Silicon-Carbon
    - Ptfe
    - Bt Resins
    - Phenolics
    - Melamine
    - Other Materials
    - Copper Foils
    - Glass Cloth
    - Types Of Reinforcements
    - Needs Of Microwave Circuits
    - Production Of Rigid Pcbs
    - Environmental Issues
    - Pcb Laminates
    - Lead-Free Electronic Soldering
    - Flame Retardant Issues
    - Issues Facing Plastics Usage
    - Flexible Printed Circuit Boards
    - Background
    - Technology
    - Standards
    - Advantages
    - Materials Used
    - Overview
    - Polyimides
    - Polyesters
    - Liquid Crystalline Polymers
    - Aramids
    - Epoxy Resins
    - Adhesiveless Laminates
    - Rigid-Flex Circuits
    - Comparison Between Rigid And Flexible Circuit Boards
    - Production Statistics
    - Biodegradable Pcbs
  - Market Estimates And Forecasts
- Electronic Packaging
  - Overview
  - Background
  - Through-Hole Technology
  - Wire Bonding
  - Tape Automated Bonding (TAB)
    - Overview
    - Advantages
  - Chip-On-Board (COB)
    - Background
    - Advantages/Disadvantages
    - Substrate Materials
  - Flip Chip Bonding
  - Dual-In-Line
  - Surface-Mount Technology (SMT)
    - Background
    - Details
    - Design And Manufacturing Process
    - Advantages Vs. Through-Hole
    - Wave Soldering Moving To Vapor Phase/Ir
    - Resin And Material Usage
    - Competitive Resin Scenario
  - Other Key, Selected Electronicpackaging/Interconnection Technologies
    - Multichip Modules (MCMS)
    - Background
    - Rationale For Use
    - Types Of Mcms
    - Materials Used
    - Problems For Mcms
  - Pin Grid Arrays (PGAS)
    - Dga Vs. Bga
    - High-Density Chips
    - Background
    - Technology
    - Materials Used
    - Background
    - Epoxy Alternatives
    - Current Alternatives With Polyimides
  - Potential Replacements For Conventional Interconnects
    - Background
    - Interconnect Packaging Evolution
    - Background
    - Smt Chip Carriers
    - Molded/3d Pcbs
    - Background
    - History
    - How Do They Differ From Pcbs?
    - Materials Used
    - Market Target
    - Process Technologies
    - Impact Of Mids
    - Recent Developments
    - Degussa And Bayer
    - Ticona
    - Basf
  - Encapsulants
    - Definitions And Background
    - Primary Purposes Of Encapsulation
    - Organic Encapsulants
    - Background
    - Impact Of Thermoplastics
    - Background
    - Types And Application Modes
    - Epoxy Encapsulation Formulations
    - Encapsulated Electrical Components
    - Background
    - Specific Encapsulant Applications
    - Specifications And Standards
    - Overview
    - Ul 1694 Looks At Circuit Boards
    - Major Selected Encapsulant Producers And Their Product Lines
    - Huntsman
    - Lord Chemical
    - Loctite
    - Henkel
    - Recent Developments
    - Basf
    - Lnp
    - Rtp
    - Bayer
    - Market Estimates And Forecasts
- Molded Electronic Products
  - Overview
  - Background
  - Resins Used
  - Demand
  - Market Drivers
  - Connectors
    - Background
    - Trends
    - Function Of Connectors
    - Resin Selection
    - Manufacturers
    - End-Use Markets
    - Background
    - Communications Industry
    - Automotive Industry
    - Background
    - Resin Scenario
    - Other Markets
    - Market Estimates And Forecasts
  - Switches
    - Background
    - Market Estimates And Forecasts
  - Bobbins
    - Background
    - Market Estimates And Forecasts
  - Relays
    - Background
    - Market Estimates And Forecasts
  - Capacitors
    - Background
    - Applications
    - Consumption By Market Segment
    - Market Estimates And Forecasts
  - Other Molded Electronic Components
    - Resistors
    - Background
    - Applications
    - Inductors/ Transformers
    - Market Estimates And Forecasts (Other Molded Electronic Components)
  - New Developments That Will Affect Discrete Electronic Molded Components
    - Background
    - Molded Electronic Parts Have Become Thinner
    - Combining Passive And Interconnect Devices With Ceramics
  - Molded Electronic Component Summary
- Summary Market Estimates And Forecasts For Electronic Devices
  - By Application
  - By Resin
Application By End-Use
- Background
- Computers And Business Equipment
  - Background
  - Desktop Computers
  - Monitors
  - Keyboards
  - Notebooks
  - Hand-Helds
    - Background
    - Other Hand-Held Computer Aspects
    - Power Considerations
  - Printers
  - Scanners
    - Facsimile Machines (Fax Machines)
  - Copiers
  - Phones
    - Corded
    - Cordless
    - Cellular
  - Pagers
- Consumer Electronics
  - Overview
  - Background
  - Television Sets
  - Digital Cameras
- Automotive Under-The Hood
  - Overview
  - Cafe Issues
  - Overview Of Electronic Components
  - Flexible Circuitry
  - Material Usage
  - Expanded Use Of Encapsulated Components
  - Bobbins/Connectors
  - Switches/Sockets
  - Ignition Components
  - Trends And Developments
    - Polymer Fuses
    - New Polyphthalamide
- Appliances
  - Overview
  - Appliance Usage In U.S. Households
  - Key Applications For Plastics In Appliances
  - Electronic Molded Products
- Medical Devices
  - Overview
  - Testing And Diagnostic Equipment
    - Overview
    - Diagnostic Equipment
    - Electromedical Equipment
    - Clinical Laboratory Equipment
- Market Estimates And Forecasts
Technology Trends Related To Electronic Components
- Background
- Importance Of Miniaturization
- Packaging
- Concept Of Micromolding
- Replacement Of Ceramics With Plastics
- Thinwalling Electronic Components
  - Background
  - Thinwalling Is Not A Novel Concept
  - Effects On Performance Requirements And Design
  - Application Requirements
  - Material And Process Selection
  - Properties Required
  - Challenges In Downsizing
  - Software That Aids Thinwall Design
- Flexible Electronics
- Printed Electronics
Electronic Component Industry Overview
- Top Electronic Industry Manufacturers
- Structure Of Electronic Components Industry
- Marketing Aspects
  - Outsourcing
  - What Plastic Molders Are Doing
  - Upstream Manufacturing
  - Contract Manufacturing
Resin Producers
- Overview
- Major Players In The Resin Electronic Component Market
  - Thermosets
    - Epoxies
    - Phenolics
    - Polyesters
    - Dap
  - Thermoplastics
    - Nylon 6
    - Nylon 66
    - Other Nylons
    - Polyesters
    - Pps
    - Polyimides
    - Polycarbonates
    - Lcps
    - Polysulfones
    - Fluoropolymers
    - Polyphthalamides
    - Polyketones
Pricing
Molders Of Electronic Components
Regulations
- Background
- Details Of Rohs Directive
Recycling
- Background
- United States
- Europe
- Asia
- Electronic Industry Interface
Environmental Issues
- Overview
- Printed Circuit Board Disposal
- Halogen-Free Printed Circuit Boards
Selected Company Profiles
- Aoc, Inc. - Colliersville, Tn
- Asahi Kasei Chemical - Tokyo, Japan
- Ashland Specialty Chemical - Dublin, Oh
- Basf - Florham Park, Nj
- Bayer Corporation - Pittsburgh, Pa
- Bulk Molding Compounds - Chicago, Il
- Chevron Phillips Chemical - The Woodlands, Tx
- Cytec Industries (Olean Division) - Olean, Ny
- Cosmic Plastics - Valencia, Ca
- Daikin Industries - Tokyo, Japan
- Dow Plastics - Midland, Mi
- Dsm Resins - Augusta, Ga
- Dupont - Wilmington, De
- Ems Grivory - Sumter, Sc
- Epic Resins - Palmyra, Wi
- Ge Plastics - Pittsfield, Ma
- Glastic Corporation - Florence, Ky
- Haysite Reinforced Plastics - Erie, Pa
- Hexcel Corporation - Stamford, Ct
- Hexion Specialty Chemicals - Columbus, Oh
- Huntsman Advanced Materials - The Woodlands, Tx
- Interplastic Corporation - St. Paul, Mn
- Loctite - Rocky Point, Ct
- Plastics Engineering Company - Sheboygan, Wi
- Premix, Inc - North Kingsville, Oh
- Quantum Composites - Bay City, Mi
- Rhodia Engineering Plastics - Farmington Hills, Mi
- Rogers Corporation - Rogers, Ct
- Rohm & Haas - Philadelphia, Pa
- Solutia - St. Louis, Mo
- Solvay Engineering Polymers - Alpharetta, Ga
- Solvay Solexis - Thorofare, Nj
- Ticona - Florence, Ky
- Toray Plastics - Tokyo, Japan
- Victrex, Ltd - Greenville, Sc
List Of Figures
- Summary Table: North American Consumption In Electronic Components By Type Of Resin, Through 2011 (Million Pounds)
- Table 1 Comparison Of Nylon 6 And Nylon 66 Properties
- Table 2 Nylon Producers And Capacities (Million Pounds/Year)
- Table 3 North American Nylon Market Forecast By Application, Through 2011 (Million Pounds)
- Table 4 Global Pbt Producers And Capacities (Million Pounds/Year)
- Table 5 Key North American Pet Producers And Capacities (Million Pounds/Year)
- Table 6 North American Pbt Market Forecast By Application, Through 2011 (Million Pounds)
- Table 7 North American Pet Market Forecast By Application, Through 2011 (Million Pounds)
- Table 8 North American Pps Market Forecast By Application, Through 2011 (Million Pounds)
- Table 9 North American Polyimide Market Forecast By Application, Through 2011 (Million Pounds)
- Table 10 Domestic Polycarbonate Producers And Capacities (Million Pounds)
- Table 11 North American Polycarbonate Market Forecast By Application, Through 2011 (Million Pounds)
- Table 12 North American Polyphthalamide Market Forecast By Application, Through 2011 (Million Pounds)
- Table 13 Estimates Of Global Liquid Crystal Polymer Capacities - 2006 (Million Pounds/Year)
- Table 14 North American Lcp Market By Application, Through 2011 (Million Pounds)
- Table 15 North American Polysulfone Market Forecast By Application, Through 2011 (Million Pounds)
- Table 16 North American Alloy/Blend Market By Application, Through 2011 (Million Pounds)
- Table 17 North American Fluoropolymer Market By Application, Through 2011 (Million Pounds)
- Table 18 North American Polyketone Market By Application, Through 2011 (Million Pounds)
- Table 19 North American Total Thermoplastic Resin Market Volume By Resin, Through 2011 (Million Pounds)
- Table 20 Reinforced Thermoset Properties And Manufacturing Processes
- Table 21 North American Epoxy Market Forecast By Application, Through 2011 (Million Pounds)
- Table 22 North American Polyurethane Market Forecast By Application, Through 2011 (Million Pounds)
- Table 23 North American Phenolic Market Forecast By Application, Through 2011 (Million Pounds)
- Table 24 Ingredients Of Unsaturated Polyester Resin Formulations In Descending Order Of Commercial Use
- Table 25 North American Unsaturated Polyester Market Forecast By Application, Through 2011 (Million Pounds)
- Table 26 North American Dap Market Forecast By Application, Through 2011 (Million Pounds)
- Table 27 Total North American Thermoset Resin Market Forecast By Resin, Through 2011 (Million Pounds)
- Table 28 Dielectric Constants Of Selected Materials
- Table 29 Dielectric Constants For Selected Thermoplastics
- Table 30 Comparison Between Rigid And Flex Circuitboards
- Table 31 Global Pcb Production Forecast By Geographic Area*, Through 2011 ($ Billions)
- Table 32 North American Pcb Market Forecast By Thermoplastic And Thermoset Resin, Through 2011 (Million Pounds)
- Table 33 North American Pcb Market By Thermoplastic Resin (Million Pounds)
- Table 34 North American Pcb Market By Thermoset Resin (Million Pounds)
- Table 35 Encapsulants - Application Mode, Advantages And Disadvantages
- Table 36 Epoxy Encapsulant Formulations
- Table 37 Selected Encapsulant Suppliers
- Table 38 North American Encapsulation Market Forecast By Thermoplastic And Thermoset Resin, Through 2011 (Million Pounds)
- Table 39 North American Encapsulant Market Forecast By Thermoset Resin, Through 2011 (Million Pounds)
- Table 40 North American Encapsulation Market Forecast By Thermoplastic Resin, Through 2011 (Million Pounds)
- Table 41 Demand For Passive Electronic Components (Percent Of Total Dollars)
- Table 42 Selected Manufacturers Of High Density, Multipin Connectors
- Table 43 North American Connector Market Forecast By Thermoplastic And Thermoset Resin, Through 2011 (Million Pounds)
- Table 44 North American Connector Market Forecast By Thermoplastic Resin, Through 2011 (Million Pounds)
- Table 45 North American Connector Market Forecast By Thermoset Resin, Through 2011 (Million Pounds)
- Table 46 North American Switch Market Forecast By Thermoplastic And Thermoset Resin, Through 2011 (Million Pounds)
- Table 47 North American Switch Market Forecast By Thermoplastic Resin, Through 2011 (Million Pounds)
- Table 48 North American Switch Market Forecast By Thermoset Resin, Through 2011 (Million Pounds)
- Table 49 Selected Bobbin Molders
- Table 50 Total North American Bobbin Market By Thermoplastic And Thermoset Resin, Through 2011
- Table 51 North American Bobbin Market Forecast By Thermoplastic By Resin, Through 2011 (Million Pounds)
- Table 52 North American Bobbin Market Forecast By Thermoset Resin, Through 2011 (Million Pounds)
- Table 53 Total North American Relay Market Forecast By Thermoplastic And Thermoset Resin, Through 2011 (Million Pounds)
- Table 54 North American Relay Market Forecast By Thermoplastic Resin, Through 2011 (Million Pounds)
- Table 55 North American Relay Market Forecast By Thermoset Resin, Through 2011 (Million Pounds)
- Table 56 North American Capacitor Market Forecast By Thermoplastic Resin, Through 2011 (Million Pounds)
- Table 57 Other North American Electronic Component Market Forecast By Type Of Resin, Through 2011 (Million Pounds)
- Table 58 Other North American Electronic Component Market Forecast By Thermoplastic Resin, Through 2011 (Million Pounds)
- Table 59 Other North American Electronic Component Market Forecast By Thermoset Resin, Through 2011 (Million Pounds)
- Table 60 North American Molded Electronic Component Resin Summary, Through 2011 (Million Pounds)
- Table 61 North American Thermoplastic Molded Electronic Component Resin Summary, Through 2011 (Million Pounds)
- Table 62 North American Thermoset Molded Electronic Component Resin Summary, Through 2011 (Million Pounds)
- Table 63 North American Resin Market Forecast By Application, Through 2011 (Million Pounds)
- Table 64 North American Thermoplastic Resin Market Forecast By Application, Through 2011 (Million Pounds)
- Table 65 North American Thermoset Market Forecast By Application, Through 2011 (Million Pounds)
- Table 66 Historical, Current And Projected U.S. Automotive Sales (MILLIONS)
- Table 67 Sales Of Leading Appliance Products (Millions Of Units)
- Table 68 Selected Major Applications For Polymers In Appliances
- Table 69 North American Plastics Consumption In Electronic Components By Major End-Use Industry Grouping, Through 2011 (Million Pounds)
- Table 70 North American Plastics Consumption Of Electronic Components In Other Markets, Through 2011 (Million Pounds)
- Table 71 Top Global Semiconductor Companies ($Billion)
- Table 72 Selected List Of Active/Passive And Passive Electronic Components
- Table 73 Trade Names Of Selected, Key Resins Used In Electronic Components And Related Electrical/Electronic Products
- Table 74 North American List Prices For Selected Resins Used To Mold Electronic Components (Dollar/Lb)
- Table 75 Sales Of Top Electric/Electronic Injection Molders ($ Million)
List Of Figures
- Summary Figure:
North American Consumption In Electronic Components By Type Of Resin, 2005-2011 (Million Pounds)
- Figure 1 North American Total Thermoplastic Resin Market Volume By Resin, 2005-2011 (Million Pounds)
- Figure 2 Total North American Thermoset Resin Market Forecast By Resin, 2005-2011 (Million Pounds)
- Figure 3 Global Pcb Production Forecast By Geographic Area, 2005-2011 ($ Billions)
- Figure 4 Total North American Bobbin Market By Thermoplastic And Thermoset Resin, 2005-2011
- Figure 5 Total North American Relay Market Forecast By Thermoplastic And Thermoset Resin, 2005-2011 (Million Pounds)