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Memory Industry Report, 2006

  • Publication Date:April 2007
  • Publisher:Research in China
  • Product Type: Report
  • Pages:140

Memory Industry Report, 2006

Memory is an electronic component indispensable to nearly all electronic products. By application, memory can be divided into three major categories, which can be represented by NAND Flash, DRAM and, NOR Flash and EEPROM respectively.

Undoubtedly, memory is of the greatest potential in electronic industry now that the demand of any memory category has been increasing rapidly. Despite the ever decreasing price, the capacity of memory keeps growing, which can offset the lost profits caused by price decline. Due to the fast upgrading of memory industry, new products, particularly in the field of DRAM, can generate huge profits. It took only one year for DDR2 substituted for DDR. Likewise, DDR2 will be replaced by DDR3 in two years or so. The gross profit margin of memory industry is usually above 15%.

Some memory producers, usually, take up with the production on their own. In the event of insufficient production capacity, they will seek for OEM wafer fabs. Other manufacturers exchange their technologies for production capacity, like Elpida and Renesas for the production capacity of Powerchip, HYNIX for that of ProMOS Technologies and, Qimonda for that of Nanya Technology.

As to memory die, most producers need the partners both in capital and technologies.

Except for Samsung, other memory manufacturers has their allied partners, such as the alliance of Hynix, ProMos and STMicroelectronics, the alignment of Micron and Intel, the coalescent of Infineon, Inotera, Nanya, Winbond and SMIC, the ally of Toshiba and SanDisk, the union of ELPIDA, Powerchip and SMIC, and the joint hands of Renesas and Powerchip.

The packaging and testing field, with higher threshold than memory die, requires to be supported by sufficient capital, technical strength and steady customers. It is beyond doubt that only Taiwanese manufacturers can do this. In the field of memory packaging, almost all memories are packaged by Taiwanese producers except for Samsung. PowerTech, ChipMOS and Walton take some 90% of the market shares. As for memory testing, PowetTech, UTAC, King Yuan Electronics and Thailin seize the majority of market shares. As for the packaging and testing field, PowerTech invested by Kingston is regarded as the leader and its production capacity utilization rate is as high as 100% with a gross margin of 30% plus.

Memory module refers to the making of memory dies, PCB and passive components into a practical memory stick. Few memory die producers like Samsung can manage the memory modules by themselves. Such producers are generally called as third-party memory module manufacturers. However, the majority of them only owns SMT production lines and can not embark on memory packaging and testing. In comparison, only a small number can do the testing. Memory packaging has to be contracted to professional packaging enterprises.

The third-party memory module manufacturers mainly focus on the retailing DIY market, and target Samsung and Hynix as the OEM market. The success of third-party memory module manufacturers mainly attributes to the market promotion and brand image. Therefore, most producers attach great importance to the promotional activities instead of products in DIY market.

The gross margin of the third-party memory module manufacturers is as low as 7-10%. Kingston, backed by Samsung, has almost monopolized the market for years while other producers only share less than 10% of market respectively. For the third-party memory module manufacturers, Tainwan-based companies are the main bodies and then come to American channel partners.

Selected Chats

  • Development Roadmap for the Rates of Memories, 2000-2011
  • Structure of MRAM
  • Basic Principle of MRAM
  • Applications of FRAM in Automobile Field
  • Product Revenue of Ramtron, 2003Q4-2006Q3
  • Proportion of Product Applications of Ramtron, 2005-2006
  • Sketch Map of Memory Industry Chain
  • Distribution of Alliances of Memory Industry
  • Market Shares of Major DRAM Manufacturers (by Income) Worldwide, 2006
  • Market Shares of Major DRAM Manufacturers (by Bits) Worldwide, 2006
  • Proportions of Major DRAM Manufacturers by 12-inch Wafer Production, 2006Q4
  • Market Shares of Major NAND Suppliers, 2006
  • Market Shares of Major NAND Suppliers, 2007
  • Market Shares of Major NOR Manufacturers, 2005
  • Market Shares of Major NOR Manufacturers, 2006
  • Development Roadmap for Mobile Phone Memory
  • Roadmap for Mobile Phone Memory Packaging
  • Average Sales Prices of DDR2 512Mb 667MHz DRAM, Oct 2005-Jan 2007
  • Average Sales Price of 256Mb Memory, 2001Q4-2007Q4
  • Proportions for Downstream Applications of DRAM (by Bits), 2010
  • Proportions for Downstream Applications of DRAM (by Income), 2010
  • Proportions for Downstream Applications of NAND Flash, 2000-2010
  • Statistics and Forecast of USB Disk Market Scale, 2005-2009
  • Statistics and Forecast of the Shipment of Flash MP3 Players, 2003-2009
  • Statistics and Forecast of Game Card Shipment, 2005-2009
  • Statistics and Forecast of Average Capacity of Game Cards, 2005-2009
  • Forecast of Flash Notebook Shipment, 2006-2010
  • Statistics and Forecast of Mobile Phone Shipment, 2005-2010
  • Proportion of Product Revenue of Samsung, 2005-2006
  • Proportion of Product Profit of Samsung, 2005-2006
  • Roadmap for Samsung's DRAM Technology
  • Roadmap for the Memories for Server, Notebook and Desktop PC, 2006-2009
  • Roadmap for Samsung's DRAM Module
  • Roadmap for Samsung's Mobile-DRAM/SRAM
  • Roadmap for Samsung's OneNAND
  • Roadmap for Samsung's Flash Memory
  • MCP/POP Solution for Samsung Mobile Phone Memory
  • Organizational Structure of ProMOS
  • Wafer Fabs of ProMOS
  • Monthly Income of ProMOS, 2006Q1-2007Q2
  • Organizational Structure of Putian ProMOS Technologies (Chongqing)
  • Organizational Structure of Powerchip
  • Wafer Fabs of Powerchip
  • Technical Roadmap of Powerchip
  • Quarterly Revenues of STMicroelectronics, 2004Q1-2006Q4
  • Proportion of Product Application of STMicroelectronics, 2006
  • Structure of Product Income of STMicroelectronics, 2005
  • Quarterly Income of SanDisk, 2003Q1-2006Q4
  • Statistical Gross Profit Margin of SanDisk, 2003-2006
  • Roadmap for NAND Technology of Sandisk
  • Roadmap for NAND Products of Sandisk
  • SanDisk Technology Transition for Total Captive Wafer Production by GB
  • Statistical Revenue and Operating Gross Profit of Winbond, 2005Q1-2006Q4
  • Revenue and Gross Profit Margin of Winbond by Division, 2005Q1-2006Q4
  • Revenues of Winbondby Product, 2006Q4
  • Statistical Sales Income of Qimonda, FY2003-2007Q1
  • Statistics on Gross Profit and Gross Profit Margin of Qimonda, 2003-2007Q1
  • Statistics on R&D Expenditure of Qimonda, 2003-2007Q1
  • Statistical Yields of Qimonda, 2003-2007Q1
  • Revenues of Qimonda by Region, 2006
  • Compositional Proportion of Product Income of Hynix, 2005Q3-2006Q4
  • DRAM Average Price and Shipment of Hynix, 2006Q1-2007Q4
  • NAND Average Price and Shipment of Hynix, 2006Q1-2007Q4
  • DRAM Average Price and Shipment of Hynix, 2005-2008
  • NAND Average Price and Shipment of Hynix, 2005-2008
  • Proportion of Product Revenue of Micron, 2004-2006
  • Statistical Income and Gross Profit Margin of Micron, 2006Q1-2007Q1
  • Statistics on R&D and Administrative Expenses of Micron, 2006Q1-2007Q1
  • Proportion of Wafer Applications of Micron, FY2007
  • Proportions for Manufacturing Techniques of Micron's Wafer Fabs, 2006-2007
  • Features of Intel Flash Memory
  • Capital Stock Structure of StELPIDA
  • Sales Income and Operating Profit of ELPIDA, 2003Q1-2006Q3
  • Statistics on Product Application Proportion of ELPIDA, 2005Q3-2006Q3
  • Output Planning of ELPIDA
  • Expansion Plan of NAND Wafer Fabs of Toshiba, 2004-2008
  • Sketch Map of MirrorBit
  • Product Structure of SPANSION
  • Statistical Revenue and Operating Profit Margin of Etron, 2001-2006
  • Corporate Structure of Etron
  • Quarterly Income and Gross Profit Margin of Macronix, 2002Q2-2006Q4
  • Proportion of Product Income of Macronix, 2005Q4-2006Q4
  • Proportion of Product Revenue of Macronix, 2005-2006
  • Proportion of Product Shipment of Macronix, 2005-2006
  • Structure of Manufacturing Procedure Income of Macronix, 2005Q4-2006Q4
  • Revenues of Macronix by Region, 2005Q4-2006Q4
  • Product Shipment of SST, 1995-2005
  • Licensed Product Shipment of SST, 2000-2005
  • Wafer OEM Partners of SST
  • Back-end Packaging and Testing Partners of SST
  • Proportion of Product Applications of SST, 2006Q1
  • Revenues of SST by Region, 2006 Q1
  • Technical Roadmap of SST
  • Revenues of SST, 2003Q1-2006Q1
  • Proportion for Revenues of SST from Non-memory Products, 2003Q1-2006Q1
  • Patent Licensing Income of SST, 2003Q1-2006Q1
  • Revenues of SST by Region, 2005Q4, 2006Q3 and 2006Q4
  • Proportion of Operating Cost of SST, 2006Q3-Q4
  • Statistics and Forecast of Revenues, Gross Profit Margin and Operating Profit
  • Margin of Walton Advanced Engineering Inc., 2004-2007
  • Statistical Gross Profit Margin of ChipMOS Technologies Inc., 2004Q1-2006Q3
  • Revenue and Operating Profit Margin of King Yuan Electronics, 2004-2007
  • Organizational Structure of King Yuan Electronics
  • Statistical Revenue and Gross Profit Margin of UTAC, 2001-2006
  • Customers of UTAC and NSEB
  • Proportion of Revenue of UTAC, 2006Q1
  • Revenue of UTAC by Region, 2006Q1
  • Statistical Profit Margin of A-DATA Technology, 2004Q1-2005Q4
  • Revenue of A-DATA Technology by Region, 2005
  • Revenue of A-DATA Technology by Product, 2005
  • Statistical Sales Income of A-DATA Technology, 2003Q1-2006Q3
  • Statistical Net Income of A-DATA, 2003Q1-2006Q3
  • Structure of Product Income of A-DATA Technology, 2006Q1-Q3
  • Statistical Revenue and Gross Profit Margin of Smart Modular, FY2002-2007
  • Statistical Revenue of Transcend, 2001-2006
  • Performance Comparison of MRAM, SRAM, DRAM, FLASH and FRAM
  • Major Manufacturers in Memory Industry Chain
  • World's Top 20 Memory Module Producers by Income, 2005
  • Ranking of World's Top Ten Memory Module Manufacturers, 2006H1
  • Memory Wafer Fabs of Samsung
  • Total Capital Invested into Wafer Fabs of SanDisk, 2004-2009
  • Wafer Fabs of Spansion
  • Testing and Packing Plants of Spansion
  • Proportion of Business Income of PowerTech Technology
  • Investment Plans of ChipMOS Technologies, 2006
  • Proportion of Customers of King Yuan Electronics, 2006
  • Statistics on Machine Sets of UTAC and NSEB
  • Cooperative Partners of Ramaxel Technology
  • 1. Brief Introduction to Memory
    • 1.1 Classification of Memory
    • 1.2 Brief Introduction to Next Generation Flash Memory
      • 1.2.1 PRAM
      • 1.2.2 MRAM
      • 1.2.3 FRAM
      • 1.2.4 Ramtron
  • 2. Memory Industry Chain
    • 2.1 Brief Introduction to Memory Industry Chain
    • 2.2 Status Quo and Future Trend of DRAM Die Production Industry
    • 2.3 Status Quo and Trend of NAND Flash Die Production Industry
    • 2.4 Status Quo and Trend of NOR Flash Industry
    • 2.5 Status Quo and Trend of Mobile Phone Memory Industry
    • 2.6 Status Quo of Memory Module Industry
  • 3. Status Quo of Memory Market
    • 3.1 Status Quo of DRAM Market
    • 3.2 Status Quo and Trend of NAND Flash Market
      • 3.2.1 Downstream Markets of NAND Flash
    • 3.3 Mobile Phone Memory Market
  • 4. Research on Memory Die Manufacturers
    • 4.1 Samsung
    • 4.2 ProMOS
    • 4.3 Powerchip
    • 4.4 STMicroelectronics
    • 4.4 SanDisk
    • 4.5 Nanya
    • 4.6 Winbond
    • 4.7 Qimonda
    • 4.8 Hynix
    • 4.9 Micron
    • 4.10 Intel
    • 4.11 Elpida
    • 4.12 Toshiba
    • 4.13 Spansion
    • 4.14 Etron
    • 4.15 Macronix
    • 4.16 SST
  • 5. Memory Packaging and Testing Enterprises
    • 5.1 Status Quo of Memory Packaging and Testing Industry
    • 5.2 PowerTech
    • 5.3 THAILIN
    • 5.4 Walton Advanced Engineering Inc.
    • 5.5 ChipMOS
    • 5.6 King Yuan Electronics
    • 5.7 UTAC
  • 6. Memory Module Manufacturers
    • 6.1 Kingston
    • 6.2 A-DATA
    • 6.3 Smart Modular Technologies
    • 6.4 Ramaxel Technology
    • 6.5 TwinMOS
    • 6.6 Transcend
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