The Future of Organic Electronics Manufacturing

Publication Date	January 2009
Publisher	NanoMarkets
Product Type	Report
Pages	115
ISBN Number	not applicable
Product Code	NAN00073

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Summary

This NanoMarkets report takes on the issues surrounding printing and deposition technologies that are being redesigned for an organic electronics environment. The product coverage ranges from emerging areas such as polymer memories to relatively established areas such as OLEDs, and it is especially focused on how the lessons in the established OLED plants are being extended to organic electronics more generally. The report provides competitive guidance to device makers who need to understand how their sector of the OE business will evolve at the manufacturing level. The report will also be vital to manufacturing equipment and materials firms to assess what kinds of products are required by the OE industry and to assess levels of demand.

The report contains profiles of manufacturing approaches taken by leading manufacturing approaches and of the plants that they have established or plan to build. These profiles show who have the largest capacities to produce each kind of OE device and how that will change over time. They also provide an indication of what is working and what doesn t work in today s OE manufacturing environment and an insight into the proprietary manufacturing processes currently being used by OE manufacturers and where manufacturers are willing to use off-the-shelf equipment. The report provides a true status report on the use of printing in OE, showing in which devices and which layers printing has proved effective. It also shows where photolithography still continues to be the only manufacturing approach that is suitable for patterning devices. As such the report provides a guide to the true state of OE manufacturing and gets beyond the hype about the all-printed OE device.

A five-year capacity forecast is included in this report that is based on breakouts by type of manufacturing technology utilized and the type of device manufactured.

Content

Executive Summary
- E.1 Summary of Organic Manufacturing Methods
- E.1.1 Printing vs. Blanket Deposition
- E.1.2 Major Deposition Methods
- E.1.3 Major Device Categories and Requirements
- E.2 Opportunities for Equipment Producers
- E.3 Opportunities for Materials Suppliers
- E.4 Major Equipment Suppliers
- E.5 Summary of Capacity Forecasts for Organic Electronics
Chapter One: Introduction
- 1.1 Background to this Report
  - 1.1.1 Perspective #1: Availability of Equipment
  - 1.1.2 Perspective #2: Availability of Materials
  - 1.1.3 Perspective #3: Device and Process Readiness
  - 1.1.4 Perspective #4: Market Readiness
- 1.2 Objectives and Scope
- 1.3 Methodology
- 1.4 Plan of this Report
Chapter Two: Key Manufacturing Trends in Organic Electronics
- 2.1 Current and Future Manufacturing Technologies for Organic Electronics
  - 2.1.1 Classical and Novel Vapor Deposition Techniques
  - 2.1.2 Printing
  - 2.1.3 Patterning Techniques
  - 2.1.4 Other Relevant Techniques
  - 2.1.5 Note on Crystallinity
- 2.2 Manufacturing Requirements by Product Category
  - 2.2.1 OLED
  - 2.2.2 Organic Thin Film Transistors
  - 2.2.3 Organic Photovoltaics
  - 2.2.4 Organic Photodetectors
- 2.3 Enhancement of Stability
- 2.4 Key Points Made in This Chapter
Chapter Three: Organic Electronics Manufacturing Technologies
- 3.1 Introduction
- 3.2 OLEDs
  - 3.2.1 Evaporated Small Molecule (Kodak and UDC)
  - 3.2.2 Small Molecule Solution Processing (DuPont)
  - 3.2.3 Printed Polymer (CDT/Sumitomo)
  - 3.2.4 Roll-to-Roll Polymer (GE)
  - 3.2.5 Market Context, Competition
- 3.3 OTFT
  - 3.3.1 Pentacene-OLED Backplane (Sony)
  - 3.3.2 Pentacene-E-Paper Backplane (Polymer Vision)
  - 3.3.3 Printed Polymer-E Paper Backplane (Plastic Logic)
  - 3.3.4 Printed Organic RFID Chips (PolyIC, IMEC)
  - 3.3.5 Other Processes (Infineon, 3M, ORFID, etc.)
  - 3.3.6 Notes on Stability
  - 3.3.7 Competitors to OTFTs by Target Market Application
- 3.4 Solar Cells
  - 3.4.1 Printed Bulk Heterojunction (Konarka)
  - 3.4.2 Transparent Cell Technology (Solarmer)
  - 3.4.3 Printed Dye Solar Cells (G24i)
  - 3.4.4 Market Risk and Competitors
- 3.5 Photodetectors and Sensors
  - 3.5.1 X-Ray Detector (Siemens)
  - 3.5.2 Printed Biodetector (NANOIDENT)
  - 3.5.3 PARC
- 3.6 Specialized Materials
  - 3.6.1 Substrates
  - 3.6.2 Semiconductors
  - 3.6.3 Barrier Materials
- 3.7 Equipment
  - 3.7.1 Generic Equipment
  - 3.7.2 Printers
- 3.8 Key Points Made in this Chapter
Chapter Four: Organic Semiconductor-Based Device Capacity Forecasts
- 4.1 Introduction and Forecasting Methodology
  - 4.1.1 Forecasting Capacity
  - 4.1.2 Forecasting Equipment
  - 4.1.3 Changes from Previous NanoMarkets Reports
  - 4.1.4 Data Sources
- 4.2 Eight-year Capacity Forecasts by Type of Device Produced
  - 4.2.1 Organic Light Emitting Diodes (OLEDs)
  - 4.2.2 Organic Thin-Film Transistors (OTFTs)
  - 4.2.3 Organic Photovoltaics (OPVs)
  - 4.2.4 Organic Photodetectors and Sensors (OPDs)
- 4.3 Eight-year Equipment Forecasts by Type of Device Produced
  - 4.3.1 Methodology
  - 4.3.2 OLED
  - 4.3.3 OTFT
  - 4.3.4 OPV
  - 4.3.5 OPD
- 4.4 Eight-year Capacity Forecasts by Type of Manufacturing Equipment Used
Abbreviations and Acronyms Used in This Report
List of Exhibits
- Exhibit E-1: Worldwide Organic Manufacturing Capacity (million sq.meters/yr)
- Exhibit E-2: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)
- Exhibit 4-1: Worldwide OLED Capacity
- Exhibit 4-2: Worldwide Capacity for OTFT-Based Backplanes
- Exhibit 4-3: Worldwide Capacity for OTFT-Based RFID
- Exhibit 4-4: Worldwide Capacity for OTFT-Based Backplanes and RFID
- Exhibit 4-5: Worldwide Capacity for OPV- and DSC- Based Solar
- Exhibit 4-6: Worldwide OPD Device Capacity
- Exhibit 4-7: OLED Display Process Comparison*
- Exhibit 4-8: Unit Operations Capacity Costs (US$ per square meter per year annual capacity)
- Exhibit 4-9: Capacity Demand for Benchmark Devices by Unit Operation
- Exhibit 4-10: Equipment Costs by Device (US$ per square meter per annual capacity)
- Exhibit 4-11: OLED Display Capital Expenditure
- Exhibit 4-12: OLED Lighting Capital Expenditure
- Exhibit 4-13: OTFT-based Backplanes Capital Expenditure
- Exhibit 4-14: OTFT-based RFID Capital Expenditure
- Exhibit 4-15: Worldwide OPV and DSC Capital Expenditure
- Exhibit 4-16: Worldwide Capacity by Equipment Type (Millions m2/yr)
- Exhibit 4-17: Worldwide Capital Expenditure by Equipment Type ($ Millions/yr)
- Exhibit 4-18: Worldwide Organic Manufacturing Capacity (million square meters/yr)
- Exhibit 4-19: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)