European Fabless Report
| Publication Date | March 2009 |
|---|---|
| Publisher | Future Horizons |
| Product Type | Book |
| Pages | 400 |
| ISBN Number | not applicable |
| Product Code | FUZ00003 |
Buy this product or for assistance call +44 20 7060 7474
Summary
Fully revised and completely updated, this Edition of the Future Horizons' "Semiconductor Application Markets Report" analyses in detail the global key semiconductor applications market drivers. The SAM covers the historical data for the previous five years, together with a five year forecast. In total, the 29 key market segments analysed accounted for approximately 90 percent of the total semiconductor market. The report analyses in detail the technology and market factors driving the various key applications, their future development prospects, regional trends and market players, together with estimates for the anticipated semiconductor revenue, unit volume and ASP trends, many of which will drive the System on Chip (SoC) industry. Please note this report can be purchased separately or provided complementary when purchased in conjunction with the Annual Semiconductor Report.
Content
- 1.0 Introduction
- 1.1 Scope
- 1.2 Methodology
- 2.0 Introduction
- 2.1 European Semiconductor Industry Evolution
- 2.2 Applications Market Environment
- 2.3 Oem Industry Changes
- 2.4 Business Model Developments
- 3.0 Introduction
- 3.1 Driver - Oem Strengths In Europe
- 3.2 Driver - End User Demand
- 3.3 Driver - Integration Trends
- 3.4 Driver - Time To Market
- 3.5 Driver - Reusable Intellectual Property
- Ip Exploitation
- Re-Use Of Ip
- Importance Of External Ip Sources
- 4.0 Introduction
- 4.1 Ip Location, Evaluation & Libraries
- 4.2 Valuing Intellectual Property (Ip)
- 4.3 Ip Protection, Licensing & Negotiation
- 4.5 Security Of Ip Technology
- 4.6 Evaluation & Delivery Issues
- Types Of Core
- Hard & Soft Ip Delivery Formats
- 5.0 Independent Contract Design Houses
- 5.1 Captive Ic Design Houses
- 5.2 Fabless Semiconductor Companies
- 5.3 Chipless Ip Vendors
- 5.4 Design House Chronology
- 5.5 Skill Clusters
- 5.6 Geographical Distribution
- 6 Company Skills & Profiles
- 6.0 Introduction
- 6.1 Alphabetical List Of All Companies
- 6.2 European Companies, By Company Type
- Chipless Companies
- Fabless Companies
- Contract Design House Companies - Digital
- Contract Design House Companies - Mixed-Function
- Contract Design House Companies - Mixed-Signal
- Contract Design House Companies - System On Chip (Soc)
- Design House Service Companies
- 6.3 European Ic Designcompanies, By Country
- Austria
- Belgium
- Denmark
- England
- Finland
- France
- Germany
- Greece
- Ireland
- Israel
- Italy
- The Netherlands
- Northern Ireland
- Norway
- Portugal
- Scotland
- Spain
- Sweden
- Switzerland
- Wales
- 6.4 Ip Resources In European Design Companies
- Families & Categories
- 6.5 Companies With Analogue Skills
- Analogue Interface
- Analogue Rf
- 6.6 Processing Ip
- Central Processing Units (Cpu)
- Digital Signal Processing (Dsp)
- Memory
- 6.7 Connectivity Ip
- Bus Systems
- Modems & Xdsl
- Networks
- Optoelectronics
- 6.8 Vlsi Application Ip
- Automotive
- Encryption
- Graphics
- Internet
- Peripherals
- Radio Baseband
- Sensor Interfacing
- Telecommunications
- Video/Audio
- Vlsi Integration - Asics & Fpgas
- Software (Embedded) Ip
- 6.9 Design Support & Verification
- Ip Services
- Verification Services
- 8 Ic Design House Database Disk Available
- Appendix A - Glossary Of Terms
- Appendix B - About Future Horizons
Delivery Details
PDF:Immediate delivery
PRINT/CD-ROM:Despatched within 2 working days
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