WLP & Embedded Die Technologies 2008

Publication Date	February 2008
Publisher	Yole Développement
Product Type	Report
Pages	230
ISBN Number	not applicable
Product Code	YOL00060

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£2,930.00
approximately: $4,369 | €3,490

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Summary

If we take a look at the amazing learning curve of the semiconductor industry in terms of chip density versus cost improvements over time, it is easy to realize that a gap is widening between the scaling evolutions of the chip front-end and the packagingassembly manufacturing industries.

Wafer level packaging (WLP) is all about filling that gap by making the packaging and assembly steps a whole collective wafer level process. Packaging has now the potential to scale with the cost and size evolutions of most stringent semiconductor applications. As a generic description, WLP should be defined as "all packaging and assembly process steps are done at the wafer level, the last step being the chip dicing". Subsequently, WLP does not require any intermediate substrate interposer: wafer level packaged components are directly "surface mountable" onto the circuit board. WLP is definitively a breakthrough technology to be diffused even into the most cost sensitive applications as it will scale favorably to the trend to manufacture on ever increasing wafer diameters.

Actually, it is difficult to estimate what is the real status of volume production for WLP. This new packaging report aims at giving clues to understand technologies, trends and market status of WLP in Semiconductor ICs, CMOS imagers and MEMS applications.

The report presents:

WLP definition & market drivers
Key technologies for WLP manufacturing
Photo Resists & Dry films for WLP
Lithography options for WLP
Materials selection for wafer level packaging applications
WLP Market forecasts 2007- 2012 at the device level
WLP Materials & Equipments Market forecasts 2007 - 2012
WLP manufacturing challenges per applications: MEMS, CMOS image sensors and ICs
WLP infrastructure & supply chain evolution
Embedded die technologies & players

Yole's report gives a precise description of the different type of devices using WLP and their related manufacturing challenges. Examples of major market findings are:

For CMOS imagers, WLP is indeed already an industrial reality. Today, about 35% of CMOS imagers to be found into latest cell-phone and notebook cameras are encapsulated in a WL-CSP. We forecast that the technology could penetrate about 63% of this market in 2012 and should progressively spread from CIF/VGAs to higher resolution image sensors.
Semiconductors integrated circuits represent the largest potential for WLP. It used to be mostly restricted to small I/OS applications (e.g. integrated passive devices, LED drivers and amplifiers), however WLP technology now tends to integrate higher I/Os devices (>50) and manufactured on ever larger wafer diameters (6", 8" and 12"). Thus, we forecast WLP technology to grow from 1% of the mainstream IC with about 6 billions of units up to 2.5% by 2012. GaAs wireless RF chips are one of the most dynamic market segments with an expected CAGR > 100% over the 2007-2012 time period. The report covers power, SAW, FBAR, logic, analog and memory devices as well.
For MEMS, the term WLP has been extensively used in the industry since many years now. However, it is more a WLC Wafer Level Capping approach that is currently developed and not a "true WLP". Actually, production of first real WLP for MEMS started in 2006. WLP will account for a significant proportion of the market by 2012 (see figure). Companies like Samsung (KR), Dalsa Semiconductor (CA), Hymite (DK), Silex Microsystems (SW), Infineon (GE), IMT (US), TMT (TW) and VTI (FI) have all reported advanced developments in this area. Numerous types of MEMS are analyzed in the report: inertial (gyroscopes, accelerometers), RF (switch & resonators), Si-microphones, Biochips and optical MEMS. Proportion of MEMS devices to be encapsulated in a real WLP is going to rapidly expand in volume with a CAGR of more than 100% over the 2007-1012 time period.

Ultimately, WLP market value has been evaluated over 2007-2012 for MEMS, GaAs wireless, CMOS image sensors, power devices, SAW, FBAR, logic, memories and IPDs. Market forecasts have being established at the material, equipment and device levels, in both wspy (wafer start per year) and in MUS$.

Companies in the report

Amkor, Asahi, ASE, Analog Devices, Air Products, Austriamicrosystems, Arch Chemical, AvagoTech, AVX, Brewer Sciences, Bosch, California Micro Devices, Casio Computer, CEA Leti, Clover Electronics, Dalsa Semiconductor, DNP, DOW Chemical, Dupont, Enthone, Epcos, EPWorks, EVGroup, Fraunhofer-IZM, Freescale, Fujikura, Fujifilm, Hymite, i2a, Imbera Electronics, Ibiden, IBM, IME, IMEC, IMT, Infineon, JSR Micro, Mentor Graphics, MicroChem, Micron, National Semiconductor, Nanya, NEC Toppan Circuit, Nokia, Philips-NXP, OKI Electric, Omnivision, OptoPAC, Pac Tech, Replisaurus Technologies, RFMD, Rohm & Hass, Samsung, Schott, Sensonor, Silex, SiTime, Shin-Etsu, Shinko, Skyworks, StatsChipPac, STMicroelectronics, SPIL, Sumitomo, SUSS MicroTec, Telephus, Tessera, Texas Instruments, TOK, Toshiba, Triquint, Tronic's Microsystems, Touch Microsystems Technology, TSMC, Ultratech, VTI, Xintec, ZyCube

Content

Executive Summary
WLP Definition & Market drivers
- History & definitions
- Wafer Level vs. Traditional Packaging supply chain
- Market drivers for WLP
- Flip-chip vs. WLP bumps characteristics
- Flip Chip, BGA & WLP technologies comparison
Key technologies for WLP manufacturing
- Key process steps, technologies and equipments
- Redistribution process details
- Future options for redistribution technologies
- WLP trends at the RDL level
- High reliability WLP without underfiller
- Fujikura and Infineon compliant bumps
- Integration of passives at the RDL level
- Example of integration of IPDs at the RDL level
- Reliability & Tests issues for WLP
Photo Resists & Dry films for WLP
- Passivation & RDL Resists & Films specifications
- Bumping applications Resists & Films specifications
- Thick photoresists applications
- Permanent vs. strippable resists
- Positive vs. negative photo-resists
- SU8 epoxies for packaging applications
- Dry films for WLP
- Material Segmentation per WLP applications
- Bumping technologies overview
- Lead Free Plating Process
- Typical Solder bump process flow
- A specific bumping approach: C4NP
- Example of application: Gold bumps for LCD driver ICs
Lithography technologies for WLP
- Deposition technologies comparison
- Stepper vs. Mask aligner for WLP
- Non-Lithographic plating (ECPR) for IPD & RDL
Conclusions on Materials for Advanced Packaging
- Materials selection summary for Advanced Packaging
- Material challenges summary
- Dry film vs Liquid Resists?
- Materials critical Properties for WLP
- Electronic material suppliers offer
WLP Market forecasts 2007- 2012
- WLP Market forecasts in M$ for CIS, MEMS and ICs
- WLP Market forecasts in wspy for CIS, MEMS and ICs
- WLP detailed forecasts: Breakdown by product in wspy
- WLP detailed forecasts: Breakdown by product in M$
- WLP Market Segments Attractiveness (CAGR, M$)
- WL-CSP penetration rate into Nokia's cell-phones
WLP Materials & Equipments Market forecasts
- Semiconductor Equipment forecasts by segment
- WLP Equipment forecasts in MUS$
- Packaging Materials Market 2007 status
- Materials overview used for WLP
- WLP Materials Market forecasts Breakdown
- Permanent vs. Strippable WLP resists forecasts
WLP Applications
- WLP for IC Semiconductors
  - WLP IC wafer forecasts, penetration rate into mainstream Semiconductor, drivers for IC applications, WLP case for DR memories, Technical & Cost, Challenges, WLP for CIS market forecasts, WL-CSP Market forecasts for CIS, CIS suppliers Market Shares, Market drivers for WL-CSP in CIS, Future challenges at the wafer level for CIS, Wafer level optics...
- WLP for MEMS
  - MEMS packaging: Different approaches for WLP, MEMS overall Market per Application, WLC MEMS wafers forecasts, WLP MEMS wafers, forecasts per Application, MEMS packaging Trends: Roadmap of Analog Devices, Wafer Level Capping techniques, WLP techniques...
WLP infrastructure & Supply Chain
- WLP activities: Worldwide geographical mapping
- WLP infrastructure challenges
- WLP supply chain
- Back-end players packaging activities breakdown
Top packaging and testing houses market shares
- Embedded Die Technologies
- Embedded module technology roadmap
- Embedded Passives with 3D Packaging
- Embedded packaging technologies vision from ST
- Passives integration options
- Freescale: 3D integration vision
- Imbera embedded die technologies
- Embedded dice technology from ST
- Nokia Embedded Technologies Packaging Roadmap
- Embedded active device by NEC Toppan Circuit Solutions
- Embedded technologies: Player's Activities Comparison
- Conclusions on Embedded Die Technologies
Main conclusions
Annexes
- Yole's 3DIC / TSV / WLP activity presentation
- Yole Development Company presentation
List of tables & figures
- WLP Market Forecasts in for CIS, MEMS and ICs
- WLP detailed forecasts: Product Breakdown
- WLP Market Segments Attractiveness
- 3D interconnects Technology Roadmap
- WL-CSP Applications Space
- Material Segmentation per WLP applications
- Bumping technologies overview
- Steppers vs. Mask aligners for WLP: COO comparison
- Material challenges summary
- Materials critical Properties for WLP
- Electronic material suppliers offer
- WLP Market forecasts in M$ for CIS, MEMS and ICs
- WLP Market forecasts in wspy for CIS, MEMS and ICs
- WLP detailed forecasts: Breakdown by product in wspy
- WLP detailed forecasts: Breakdown by product in M$
- WLP Market Segments Attractiveness (CAGR, M$)
- WLP Equipment forecasts in MUS$
- Packaging Materials Market 2007 status
- WLP Materials Market forecasts Breakdown
- Permanent vs. Strippable WLP resists forecasts
- WLP IC wafer forecasts
- Detailed breakdown
- WLP penetration rate % into mainstream Semiconductor
- WLP for CIS market forecasts (in wspy) per resolution
- WL-CSP Market value forecasts for CIS per resolution
- CIS suppliers Market Shares Q1-2007
- MEMS overall Market per application (M$)
- WLC MEMS wafers forecasts in wspy / M$
- WLP MEMS wafers forecasts per application in wspy / M$
- WLP activities: Worldwide geographical mapping
- WLP infrastructure challenges
- Back-end players packaging activities breakdown
- Top packaging and testing houses market shares
- Nokia Embedded Technologies Packaging Roadmap
- Embedded technologies: Player's Activities Comparison