Report Buyer, the online destination for business intelligence for major industry sectors, has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end.
According to WLP & Embedded Die Technologies 2008 Wafer Level Packaging (WLP) is about to fill that gap by allowing the packaging and assembly steps to be performed at the wafer level.
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