Flash Packaging
What Phone Makers Want & Why
| Publication Date | February 2008 |
|---|---|
| Publisher | Objective Analysis |
| Product Type | Report |
| Pages | 32 |
| ISBN Number | not applicable |
| Product Code | OBJ00005 |
Summary
February 8, 2008 - Los Gatos, CA: Flash multichip packages are predominantly NOR/RAM configurations today and are likely to remain that way for the next few years. That's the key finding of a new study by Objective Analysis entitled: Flash Packaging: What Phone Makers Want & Why.
"NAND is making great headway in cell phone handsets through both cards and embedded NAND stacks, but the MCP (multichip package) is still largely a NOR/RAM product," said Jim Handy, the report's author. "Although NAND flash is finding some acceptance in handset MCPs, cell phone manufacturers find that they have more flexibility by leaving the NAND out of this type of package."
This 32-page report is an in-depth review of the flash MCP market for cell phone handsets and looks into the reasons that OEMs choose the chip configurations they do. The report covers all aspects of this decision - features, costs, power consumption, and even the operating system - to determine the outlook for MCPs in five key types of cell phones: Basic, VGA Camera, High-Resolution Camera, Music, and Full-Feature handsets.
Readers will gain a solid understanding of multichip packages and the markets they serve, and will learn why certain configurations will ship in higher volumes than others. Nineteen tables deliver detailed forecasts through 2012; eight figures help explain how and why cell handset suppliers choose different MCP options.
Objective Analysis
Objective Analysis is a semiconductor market research and business consulting firm covering all aspects of the semiconductor industry, market, and applications. Our seasoned analysts pride themselves in helping clients take the lead in important emerging markets.
Content
- Executive Summary
- Cell Handset Needs
- Why Stack Memories?
- How Architecture Determines Memory Mix
- How Features Determine Memory Configuration
- Camera Resolution
- Operating System Considerations
- Music Player Feature
- Memory Expandability - Flash Cards
- Pricing's Play in These Decisions
- Role of Minimum NAND Density
- Which Stacks are Most Desired?
- Multi-Chip Packages (MCP)
- Package on Package (POP)
- Package in Package (PIP)
- Other
- Through-Silicon Vias
- Folded Substrates
- System in Package (SIP)
- MCP Markets by Handset Type
- Full-Feature Handsets
- Music Handsets
- High-Resolution Camera Handsets
- VGA Camera Handsets
- Basic Handsets
- Combined Stacked Chip Forecast
- Total MCP Forecast
- Methodology
- Figures
- Tables
- Author
- Jim Handy
- Figures
- Figure 1. Example of the Chips within an MCP
- Figure 2. Average Memory Configuration by Handset Type
- Figure 3. Magnified View of Handset Memory Configuration
- Figure 4. XiP and SnD System Models
- Figure 5. NAND Quarterly Average Price per Gigabyte History
- Figure 6. 2007 NAND Weekly Average Price per Gigabyte
- Figure 7. Typical NAND Process Roadmap
- Figure 8. Unit Shipments of MCP by Type for all Handsets
About this Product
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