EDC Sails out of LRM Harbor

Publication Date	April 2008
Publisher	Ovum
Product Type	Report
Pages	10
ISBN Number	not applicable
Product Code	OVM00512

Price

£550.00
approximately: $1,080 | €699

PDF

PRINT £600 ($1,179 | €763)

Order above formats by FAX

Summary

Vendors showcased improved versions of EDC (electronic dispersion compensation) chips at the OFC/NFOEC conference in February. Though all aimed at the LRM modules market initially, EDC chips are now vying for design sockets on system boards that support SFP+ form factors. As uncertainty continues to cloud the LRM market, EDC is tackling additional applications including copper.

Content

Table of Figures
- Application Drivers Changing
- Lrm Now Available but Still Slow to Ramp
- Sfp+ Changes The Game
- Edc for Sfp+ Must Appeal to System Designers
- System Vendors Are Also Customers for Backplane Applications
- What More Is Needed?
- Sfp+ Still Looking for Improvement
- Technology Choices and Business Strategy
- Multiple Tech Choices Make for Complex Competitive Positioning
- Digital vs. Analog Schism Is Really Shades of Gray
- Serdes vs. Cdr Schism
- Secondary Markets Emerging
- Copper Twin-Ax and Backplane Kr Included
- Business Climate
- Vendor Landscape
- Predictions
- Edc Increasingly Part of Standard Toolkit from Backplane to Long-Haul as Speeds Move past 10gbps
Table of Figures
- Figure 1 Xaui-Based Sfp+ Board Design Concept
- Figure 2 Xfp and X2 Module Applications Using Cdr with Edc
- Table 1 Product Comparison of Lrm Edc Chips