Taiwanese IC Packaging & Testing Industry, 4Q 2020

Taiwanese IC Packaging & Testing Industry, 4Q 2020

  • January 2021 •
  • 18 pages •
  • Report ID: 1937925 •
  • Format: PDF
The report finds that shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$ 4.58 billion in the third quarter of 2020, up 4.6% sequentially and 10.5% year-on-year. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019 and was mainly attributed to order shifts from IDMs (Integrated Device Manufacturers) due to city lockdowns worldwide. Despite the cooling demand in the consumer market, the industry is expected to have continued growth throughout 2020, mainly owing to 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts.
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