Taiwanese IC Packaging & Testing Industry, 1Q 2019

Taiwanese IC Packaging & Testing Industry, 1Q 2019

  • April 2019 •
  • 18 pages •
  • Report ID: 2057069 •
  • Format: PDF
The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.9 billion in the fourth quarter of 2018, up year-on-year but down sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to have grown about 8% in 2018 compared to 2017. Amid the slowdown in shipment growth in the first quarter of 2019, the industry is anticipated to show a modest pickup in shipment growth in the second quarter of 2019.
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