Taiwanese IC Packaging & Testing Industry, 1Q 2021

Taiwanese IC Packaging & Testing Industry, 1Q 2021

  • March 2021 •
  • 18 pages •
  • Report ID: 2057069 •
  • Format: PDF
The report finds that shipment value of the Taiwanese IC packaging and testing industry, or OSAT (Outsourced Semiconductor Assembly and Testing) reached US$4.8 billion in the fourth quarter of 2020 and registered over 4% sequentially growth and 10.6% year-on-year growth. The Taiwanese industry’s growth in the first half of 2020 performed better than the same period of 2019 and was mainly attributed to order transfer of IDMs (Integrated Device Manufacturers) due to city lockdowns worldwide. Owing to 5G commercialization, home economy due to COVID-19, and new smartphone and game console rollouts, the industry reached US$18 billion and enjoyed over 16% year-on-year growth in 2020, up from US$15.5 billion in 2019. Catering to the customers’ continued demand for notebook PCs and displays, the industry’s growth will likely to continue into the first half of 2021, driven mainly by inventory replenishments.
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