Reverse Costing of Apple iPhone 6 iPhone 6 and 6 plus  rear cameras

Reverse Costing of Apple iPhone 6 iPhone 6 and 6 plus rear cameras

  • November 2014 •
  • 234 pages •
  • Report ID: 3673865 •
  • Format: PDF
With the iPhone 6 & 6 Plus iSight camera modules, Apple improves the logic ISP circuit, passing from 65nm to 45nm technology node process, and introduces the Optical Image Stabilization system.

The iPhone 6 Plus camera module integrates the 8Mpixel resolution CMOS Image Sensor, with aperture of f/2.2 and a pixel size of 1.5µm, in a new bigger and flexible packaging concept.

The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process and uses the unique technology from Sony (Exmor-RS). The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit. This allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity.

The two camera modules, slightly different in dimensions, are both equipped with a 5-elements lens module and a VCM auto-focus actuator.