Asia-Pacific Thermal Interface Materials Market Forecast 2017-2024

Asia-Pacific Thermal Interface Materials Market Forecast 2017-2024

  • April 2017 •
  • 55 pages •
  • Report ID: 4844183
KEY FINDINGS
The Asia – pacific Thermal interface materials market is expected to value at $ 418.7 million in the year 2017 and is anticipated to hit $1,125.3 million in the year 2024 at a CAGR of 13.29% during the forecast period of 2016-2024. The forecast period for the thermal interface materials market is from 2017 to 2025 and the base year deliberated for the market study is 2016. The rising demand for sophisticated electronics, growing LED market and the need for constant connectivity are some of the key market drivers of Thermal Interface market.

MARKET INSIGHTS
The Asia –Pacific thermal interface materials market is segmented by application on the basis of theautomotive electronics market, computers industrial machinery market, telecom market, consumer durables market, medical devices market, industrial machinery market and in other applications. The Asia –Pacific thermal interface materials market is segmented by type on the basis of Tapes& Films market, metal-based market, Greases and Adhesives market, phase change materials, gap fillers and others market.

COMPETITIVE INSIGHTS
Major players in the thermal interface materials market are 3M Company, AavidThermalloyllc, Dow Corning Corporation, Epic Resins, Henkel Ag & Co. Kgaa, Honeywell International Inc, Indium Corporation, Laird Technologies Inc, Master Bond, Momentive Performance Materials Inc, Parker Hannifin Corporation, Stockwell ElastomericsInc, The Bergquist Company Inc, Wakefield-VetteInc, and Zalman Tech Co Ltd.
Country=APAC Date=201704 Topic=MarketSize Publisher=InkwoodResearch Price=2000