Global Embedded Die Packaging Technology Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast, 2017 - 2023

Global Embedded Die Packaging Technology Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast, 2017 - 2023

  • September 2017 •
  • 190 pages •
  • Report ID: 5107310
Embedded die packaging technology is the process of embedding semiconductor dies in the inner layer of a chip package, organic circuit board or module.

The global embedded die packaging technology market is expected to rise at a CAGR of 14.8 % during the forecast period 2016-2023. Embedded die packaging technology provides many advantages such as improved electrical and thermal performance, compact size, opportunity for cost reduction, heterogeneous integration, streamlined logistics for Original Equipment Manufacturers (OEMs) etc. The key factor driving the growth of global embedded die packaging technology market is the increasing number of portable electronic devices.

North America is the largest market region for global embedded die packaging technology market in terms of market revenue share. The key factors driving the growth of North American embedded die packaging technology market are the surging demand and adoption of IoT devices, growing telecommunication and automotive industry. Embedded die packaging technology is extensively used in embedded systems such as microcontroller chips and integrated circuits, digital signal processor. These electronic components are then used in mobile phones, mp3 players, digital cameras etc.

Furthermore, North America has the largest number of smartphone users. Thus, increasing smartphone user in North America drives the demand for embedded die packaging technology thereby contributing to the market growth in North America. Asia Pacific is expected to emerge as the fastest growing market region owing to the presence of key market players such as Fujikura, ASE group, Taiwan semiconductor manufacturing company etc. in Asia Pacific region.

The global embedded die packaging technology market is influenced by the presence of leading semiconductor companies such as Amkor technology, ASE group, Fujikura ltd, General Electric Corporation, Infineon technologies and others. Product launch, joint ventures, mergers and acquisition are some of the crucial strategies adopted by the key market players to gain competitive advantage.

Global embedded die packaging technology market report covers segmentation analysis of platform type and end users. Report further covers segments of platform types which include embedded die in IC package substrate, embedded die in rigid board and embedded die in flexible board. Embedded die in IC package substrate is the leading platform type segment owing to its increased adoption in DC-DC converters and camera modules which are used in smartphones. Whereas, end users of embedded die packaging technology include consumer electronics, IT & telecommunication, automotive, healthcare etc. The IT and telecommunication is the dominating end user segment as embedded die packaging technology are widely used in smartphones, routers, etc.