Global Surface Mount Technology (SMT) Equipment Industry

Global Surface Mount Technology (SMT) Equipment Industry

  • January 2021 •
  • 216 pages •
  • Report ID: 5443566 •
  • Format: PDF
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Abstract:
- The global market for Surface Mount Technology (SMT) Equipment is projected to reach US$5.6 billion by 2025, driven by technological innovations in next generation electronics, rising demand for mobile communication devices, need for speed and flexibility in electronics manufacturing, and rise in the number of electronic contract manufacturers. In the current age of electronics and digital revolution, chip architecture, production, design and packaging technologies remain important and lucrative. A host of factors are driving opportunities in key end-use industries with the most important of them being rise of smartphones as unified communication tools; ubiquitous use of radios, pagers, GPS instruments and Bluetooth devices; age of wireless networking; omnipresence of laptops/ultrabooks; growing base of connected devices; industrial automation and smart factory; integration of electronics in implants, surgical devices and diagnostic equipment; rise of telemedicine and robotic surgeries; commercialization of smart, connected and autonomous cars; development of Fly-By-Wire aircraft; and consumer IoT and emerging concept of smart connected appliances/homes. Other major factors driving growth include stable R&D investments in electronics packaging and chip design and architecture; continued focus on miniaturization of electronic components; and increased adoption of automation technologies for more efficient assembling and packaging of electronic sub-systems. Growing competition and the urgent need to increase manufacturing throughput and reduce time-to-market is helping drive strong adoption of advanced and highly efficient ‘pick & place’ machines. Few of the benefits offered by SMT machines include detection of defects, lower risk of production re-runs and improved quality control and reduced board and material handling costs perfectly suited for electronics assembly and packaging. Asia-Pacific represents the largest and the fastest growing market worldwide with a CAGR of 8.2% over the analysis period, led by booming electronics contract manufacturing sector in Southeast Asian countries; emergence of Taiwan and South Korea as hubs for semiconductor production, innovation and excellence; and strong domestic demand for electronic products and solutions.

Select Competitors (Total 84 Featured) -
  • ASM Assembly Systems GmbH & Co. KG
  • CyberOptics Corporation
  • Electro Scientific Industries, Inc.
  • Fuji Corporation
  • Glenbrook Technologies, Inc.
  • Heller Industries, Inc.
  • Illinois Tool Works, Inc.
  • Juki Corporation
  • Koh Young Technology, Inc.
  • Kulicke & Soffa Pte Ltd.
  • Mycronic AB
  • Naprotek, Inc.
  • Nikon Metrology NV
  • Nordson DAGE
  • Omron Corporation
  • Orbotech, Ltd.
  • Panasonic Corporation
  • Saki Corporation
  • Teradyne, Inc.
  • Universal Instruments Corporation
  • Viscom AG
  • Yamaha Motor Co. Ltd.
  • YXLON International GmbH