Report Synopsis The report offers a 9-year forecast of the I/O-Link between 2018 and 2027. In terms of value, the I/O-Link market is expected to register a double-digit CAGR during the forecast period. This study demonstrates the global I/O-Link market dynamics and trends across six regions: North America, Latin America, Europe, Japan, APEJ and MEA, which influence the current nature and the future status of the I/O-Link market over the forecast period.
Report Description This I/O-Link market research report provides a detailed analysis of the I/O-Link market and offers insights on the various factors driving the popularity of I/O-Link systems. The I/O-Link market report includes an extensive analysis of key industry drivers, challenges, market trends and market structure. The I/O-Link market study provides a comprehensive assessment of the stakeholder strategies and imperatives for succeeding in the business. The report segregates the market based on product type, vertical, and different regions globally.
The I/O-Link market is expected to witness significant value growth during the forecast period owing to an increase in the demand for I/O-Link systems from various industry verticals and the increasing adoption of sensors, modules, actuators and connected devices in industrial communication.
The I/O-Link market report starts with an overview of the I/O-Link market in terms of value. In addition, this section includes an analysis of the key trends, drivers and challenges from the supply, demand and economy side, which are influencing the I/O-Link market.
A detailed analysis has been provided for every segment in terms of the market size analysis for the I/O-Link market across different regions. This section also provides a detailed analysis of the key trends of the I/O-Link market.
The next section contains a detailed analysis of the I/O-Link market across various countries in the region. It provides a market outlook for 2018–2027 and sets the forecast within the context of the I/O-Link market, which includes latest technological developments as well as offerings in the market. This I/O-Link market study discusses the key trends within countries contributing to the growth of the market, as well as analyses the degrees at which the drivers are influencing this market in each region. The key regions and countries assessed in the I/O-Link market report include North America (U.S. & Canada), Latin America (Brazil, Mexico & the rest of Latin America), Europe (Germany, U.K., Spain, France, Russia & the rest of Europe), Japan, APEJ (China, India, Malaysia, Singapore, Australia & the rest of APEJ) and MEA (GCC Countries, Israel, South Africa & the rest of MEA). This I/O-Link market report evaluates the present scenario and the growth prospects of the I/O-Link market across various regions globally for the period 2018 –2027. FMI has considered 2017 as the base year, and provided data for the remaining 12 months.
To offer an accurate forecast, we have started by sizing the current I/O-Link market, which forms the basis of how the I/O-Link market will grow in the future. Given the characteristics of the I/O-Link market, FMI has triangulated the outcome of different types of analysis based on technology trends.
As previously highlighted, the global I/O-Link is split into a number of segments. All the segments in terms of component, vertical, application and different regions are analysed in terms of the basis points to understand the relative contributions of individual segments to the growth of the I/O-Link market. This detailed information is important for the identification of the various key trends in the global I/O-Link market.
In addition, another key feature of the I/O-Link market report is the analysis of all the key segments in terms of absolute dollar opportunity. This is traditionally overlooked while forecasting a market. However, the absolute dollar opportunity is critical in assessing the level of opportunity that a provider can look to achieve, as well as to identify potential resources from a sales and delivery perspective in the global I/O-Link market.
In the final section of the I/O-Link market report, we have included a competitive landscape to provide clients a dashboard view based on the categories of providers in the value chain, their presence in the I/O-Link market and key differentiators. This section is primarily designed to provide clients an objective and detailed comparative assessment of key providers specific to a market segment in the I/O-Link supply chain, and the potential players for the same. Report audiences can gain segment-specific vendor insights to identify and evaluate the key competitors based on an in-depth assessment of their capabilities and success in the marketplace. The detailed profiles of providers are also included in the scope of the I/O-Link market report to evaluate their long-term and short-term strategies, key offerings and recent developments in the I/O-Link market. Some of the key competitors covered in the I/O-Link market report are: Leuze electronic GmbH + Co. KG, SICK AG, OMRON Corporation, Pepperl+Fuchs, Rockwell Automation, Inc., Banner Engineering, Hans TURCK GmbH Co. KG, Siemens AG, Balluff GmbH and ifm electronic FZC.
By Component I/O-Link Devices
By Vertical Semiconductor and Electronics
By Application Handling Assembly Automation
Packaging Key Regions
Rest of Latin America
Rest of Europe
Rest of APEJ
Rest of MEA
Leuze electronic GmbH + Co. KG
Rockwell Automation, Inc.
Hans TURCK GmbH Co. KG
ifm electronic FZC
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