Global 3D Semiconductor Packaging Industry

Global 3D Semiconductor Packaging Industry

  • April 2021 •
  • 156 pages •
  • Report ID: 5797749 •
  • Format: PDF
Abstract:
- Global 3D Semiconductor Packaging Market to Reach $14.7 Billion by 2027
- Amid the COVID-19 crisis, the global market for 3D Semiconductor Packaging estimated at US$5.6 Billion in the year 2020, is projected to reach a revised size of US$14.7 Billion by 2027, growing at a CAGR of 14.6% over the analysis period 2020-2027. 3D package-on-package, one of the segments analyzed in the report, is projected to record a 14.4% CAGR and reach US$2.7 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 3D wire-bonded segment is readjusted to a revised 15.9% CAGR for the next 7-year period.
- The U.S. Market is Estimated at $1.7 Billion, While China is Forecast to Grow at 14.1% CAGR
- The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.7 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$2.6 Billion by the year 2027 trailing a CAGR of 14.1% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 12.8% and 12.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.8% CAGR.
- 3D Fan-out based Segment to Record 14.9% CAGR
- In the global 3D Fan-out based segment, USA, Canada, Japan, China and Europe will drive the 14.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$690.3 Million in the year 2020 will reach a projected size of US$1.8 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1.8 Billion by the year 2027.

- Select Competitors (Total 44 Featured) -
  • Amkor Technology, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • Ulvac, Inc.