Global Data Bus Industry

Global Data Bus Industry

  • October 2019 •
  • 193 pages •
  • Report ID: 5798289 •
  • Format: PDF
Data Bus market worldwide is projected to grow by US$6 Billion, driven by a compounded growth of 4.5%. MIL-STD-1553, one of the segments analyzed and sized in this study, displays the potential to grow at over 4.3%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$4.9 Billion by the year 2025, MIL-STD-1553 will bring in healthy gains adding significant momentum to global growth.

- Representing the developed world, the United States will maintain a 5.4% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$311.2 Million to the region’s size and clout in the next 5 to 6 years. Over US$277.2 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, MIL-STD-1553 will reach a market size of US$531.2 Million by the close of the analysis period. As the world’s second largest economy and the new game changer in global markets, China exhibits the potential to grow at 4.3% over the next couple of years and add approximately US$1 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

- Competitors identified in this market include, among others, Amphenol Corporation; Astronics Corporation; Corning, Inc.; Data Device Corporation; Esterline Technologies Corporation; Fujikura Ltd.; HUBER+SUHNER AG; Nexans SA; Rockwell Collins, Inc.; TE Connectivity Ltd.