Global Molded Interconnect Device (MID) Industry

Global Molded Interconnect Device (MID) Industry

  • April 2021 •
  • 196 pages •
  • Report ID: 5957428 •
  • Format: PDF
Abstract:
- Global Molded Interconnect Device (MID) Market to Reach $2.5 Billion by 2027
- Amid the COVID-19 crisis, the global market for Molded Interconnect Device (MID) estimated at US$993.8 Million in the year 2020, is projected to reach a revised size of US$2.5 Billion by 2027, growing at a CAGR of 13.8% over the analysis period 2020-2027. Automotive, one of the segments analyzed in the report, is projected to record a 15.3% CAGR and reach US$381.7 Million by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Healthcare segment is readjusted to a revised 17.5% CAGR for the next 7-year period.
- The U.S. Market is Estimated at $286.2 Million, While China is Forecast to Grow at 18.1% CAGR
- The Molded Interconnect Device (MID) market in the U.S. is estimated at US$286.2 Million in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$477 Million by the year 2027 trailing a CAGR of 18.1% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 9.9% and 12.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.9% CAGR.
- Consumer Products Segment to Record 16.2% CAGR
- In the global Consumer Products segment, USA, Canada, Japan, China and Europe will drive the 15.3% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$84 Million in the year 2020 will reach a projected size of US$227 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$377.9 Million by the year 2027, while Latin America will expand at a 18% CAGR through the analysis period.

- Select Competitors (Total 46 Featured) -
  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.