Semiconductor Assembly And Packaging Equipment Global Market Report 2021: COVID 19 Impact and Recovery to 2030

Semiconductor Assembly And Packaging Equipment Global Market Report 2021: COVID 19 Impact and Recovery to 2030

  • May 2021 •
  • 175 pages •
  • Report ID: 6071849 •
  • Format: PDF
Major players in the semiconductor assembly and packaging equipment market are Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V., Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd., and Teradyne Inc.

The global semiconductor assembly and packaging equipment market is expected to grow from $11.92 billion in 2020 to $13.44 billion in 2021 at a compound annual growth rate (CAGR) of 12.8%. The growth is mainly due to the companies rearranging their operations and recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $21.39 billion in 2025 at a CAGR of 12.3%.

The semiconductor assembly and packaging equipment market consists of sales of semiconductor assembly and packaging equipment by entities (organizations, sole traders, or partnerships) that are engaged in manufacturing equipment used for semiconductor assembly and packaging. Only goods and services traded between entities or sold to end consumers are included.

The COVID 19 outbreak hindered the growth of the semiconductor assembly and packaging equipment market.Lockdowns have been imposed in many countries across the globe affecting the manufacturing and supply chains of many industries including the semiconductor industry.

For instance, according to a survey on the impact of COVID-19 on the semiconductor industry released by the Global Semiconductor Alliance (GSA) in collaboration with KPMG, about 63% of respondents reported supply chain shortages attributing to COVID 19. The semiconductors and electronics manufacturing has suffered considerable losses during the coronavirus outbreak, adversely impacting the market growth during 2020.

The semiconductor assembly and packaging equipment market covered in this report is segmented by type into plating equipment; inspection and dicing equipment; wire bonding equipment; die-bonding equipment, by application into consumer electronics; healthcare devices; automotive; enterprise storage; others.

In July 2019, Applied Materials, Inc., a US-based company engaged in providing semiconductor chips manufacturing equipment, services, and software for electronic devices acquired Kokusai Electric Corporation for $2.2 billion. This acquisition would help the company to enhance its products & services for foundry, logic, and memory customers along with further enhancing its single wafer processing system. Kokusai Electric Corporation is a Japan-based manufacturer of semiconductor manufacturing systems.

Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market.Consumer electronics is a key segment that is entirely dependent on the semiconductor industry.

According to the India Brand Equity Foundation, the Indian appliance and consumer electronics market stood at $10.93 billion in 2019 and is expected to increase at a CAGR of 9% to reach $48.37 billion by 2022. In recent years, the applications of semiconductor Integrated Circuits (ICs) in various electronic devices is continuously increasing to perform multiple functions. Therefore, growing consumer electronics is likely to intensify the demand for semiconductor assembly and packaging equipment.