Outsourced Semiconductor Assembly and Testing Market By Process, Packaging Type, and Application : Global Opportunity Analysis and Industry Forecast, 2021–2030

Outsourced Semiconductor Assembly and Testing Market By Process, Packaging Type, and Application : Global Opportunity Analysis and Industry Forecast, 2021–2030

  • October 2021 •
  • 222 pages •
  • Report ID: 6193461 •
  • Format: PDF
Outsourced Semiconductor Assembly and Testing Market By Process (Sawing, Sorting, Testing, and Assembly), Packaging Type (Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, and Quad & Dual), and Application (Consumer Electronics, Industrial, Telecommunication, Automotive, Aerospace & Defense, Medical & Healthcare, and Logistics & Transportation): Global Opportunity Analysis and Industry Forecast, 2021–2030

The global outsourced semiconductor assembly and testing market was valued at $34.44 billion in 2020, and is projected to reach $52.93 billion by 2030, registering a CAGR of 4.9%.
Assembly and testing (manufacturing) of outsourced semiconductors offer IC-packaging and testing facilities to third parties. OSATs are merchant vendors. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. Fabless companies often outsource their packaging to the foundries and/or the OSATs. Semiconductors are also used by many modern consumer goods in daily life, such as cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. In addition, a preference for large displays, and curved OLEDs due to growing popularity of smart TVs, 4 K ultra-HD TVs, 3D programming, and video-on - demand content drives OSAT revenues. OSATs offer cost-effective and creative solutions which deliver higher efficiency, processing speeds and functionality with space reduction in an electronic device.
The factors such as increasing demand for consumer electronics and upsurge in the degree of urbanization across the globe primarily fuels growth of the market. In addition, the growing disposable income of people across the globe has significantly fueled the sales of consumer electronics devices such as TV, mobile phones, and tablets, boosting the demand for outsourced semiconductor assembly and test services. Moreover, increase in smartphone adoption significantly propels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the contrary, growing chip market is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rising transition towards in OSAT emerging economies such as India, China, and South Korea is opportunistic for the market growth.
The global outsourced semiconductor assembly and test market share is analyzed by process, packaging type, application, and region. On the basis of process, the market is analyzed across sawing, sorting, testing, and assembly. On the basis of packaging type, the market is divided into ball grid array, chip scale package, multi package, stacked die, and quad & dual. As per the application, the market is categorized into consumer electronics, industrial, telecommunication, automotive, aerospace and defense, medical and healthcare, and logistics and transportation. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key embedded processor market leaders profiled in the report include ASE Technology Holding, Co., LTD, Amkor Technology, Inc., Jiangsu Changjiang Electronics Technology Co., LTD, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, TongFu Microelectronics Co., LTD, King Yuan Electronics Corp., Hana Micron Inc., ChipMOS Technology Inc., and Unisem Group. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration.

KEY MARKET SEGMENTS

BY PROCESS
• Sawing
• Sorting
• Testing
• Assembly

BY PACKAGING TYPE
• Ball Grid Array
• Chip Scale Package
• Multi Package
• Stacked Die
• Quad & Dual

BY APPLICATION
• Consumer electronics
• Industrial
• Telecommunication
• Automotive
• Aerospace and defense
• Medical and Healthcare
• Logistics and Transportation

BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o UK
o Germany
o France
o Russia
o Rest of Europe
• Asia-Pacific
o China
o Japan
o India
o Taiwan
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East
o Africa

KEY PLAYERS
• ASE Technology Holding, Co., LTD.
• Amkor Technology, Inc.
• Jiangsu Changjiang Electronics Technology Co., LTD
• Powertech Technology Inc.
• Tianshui Huatian Technology Co., LTD.
• TongFu Microelectronics Co., LTD.
• King Yuan Electronics Corp.
• Hana Micron Inc.
• ChipMOS Technology Inc.
• Unisem Group