1. Overview / Introduction
– Executive Summary
– Reverse Costing Methodology

2. Company Profile
– InvenSense
– Digital Microphones portfolio

3. Physical Analysis
– Synthesis of the Physical Analysis
– Device Design
– Physical Analysis Methodology
Package
– Package Views & Dimensions
– Package Opening
– Package Cross-Section
ASIC Die
– View & Dimensions
– Die Marking
– Die Delayering
– Die Process
– Die Cross-Section
– Process Characteristics
MEMS Die
– View & Dimensions
– Marking
– Dicing
– Bond Pads
– Membrane & Backplate
– Central Support
– Anti-Stiction holes
– Cavity– Cross-Section
– MEMS Characteristics

4. Manufacturing Process Flow
– Global Overview
– ASIC Front
- End Process
– ASIC Wafer Fabrication Unit
– MEMS Process Flow– MEMS Wafer Fabrication Unit
– Packaging Process Flow– Package Assembly Unit

5. Cost Analysis
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Explanation
– Yields Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test & Dicing– ASIC Wafer Cost
– ASIC Die Cost– MEMS Front-End Cost
– MEMS Front-End Cost per process steps
– MEMS Front-End: Equipment Cost per Family
– MEMS Front-End: Material Cost per Family
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Wafer Cost– MEMS Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test Cost– Microphone Component Cost

6. Estimated price Analysis
– Manufacturer financial ration
– Microphone Component Price