1. Overview and Technology Trends of IGBT Industry

1.1 Definition and Classification of IGBT
1.2 Single Tube Structure of IGBT
1.3 IGBT Module Structure
1.4 Operating Principle of IGBT
1.5 Features and Prices of IGBT Modules and Single Tube
1.6 IGBT Module Packaging
1.7 Future Trend of IGBT Packaging Technology
1.8 Applied Fields and Scenarios of IGBT
1.9 Automotive Applications of IGBT
1.10 Applied Scenarios of Automotive IGBT
1.11 Evolution of Power Semiconductor Technology
1.12 Development History of IGBT Technology
1.13 Development Trend of IGBT Technology
1.14 Development of Power Semiconductor Materials
1.15 Features and Advantages of SiC Materials

2. China’s Automotive IGBT Market and Industry Chain

2.1 Chinese Passenger Car Market Size
2.2 Chinese New Energy Vehicle Market Size, 2016-2025E
2.3 New Energy Vehicle Charging Pile Ownership in China, 2017-2025E
2.4 Domestic Electric Vehicle Cost Structure and % of IGBT
2.5 Chinese IGBT Market Size, 2012-2019
2.6 IGBT Supply and Forecast of Infineon and Renesas
2.7 Chinese Automotive IGBT Market Size, 2019-2025E
2.8 Competitive Landscape in IGBT Market
2.9 Competition among IGBT Module Suppliers of Chinese BEV Models, 2019
2.10 Competition among IGBT Module Suppliers of Chinese PHEV Models, 2019
2.11 Competition Pattern of Chinese IGBT Automotive Market
2.12 Automotive IGBT Prices in China (by Supplier)
2.13 Composition of IGBT Industry Chain
2.14 Analysis on IGBT Industry Chain
2.15 IGBT Industry Chain: International Enterprises
2.16 IGBT Industry Chain: Main Product Models of International Enterprises
2.17 IGBT Industry Chain: Chinese Companies
2.18 IGBT Industry Chain: Overview of Main Chinese Participants

3. Next-generation SiC and GaN Power Devices

3.1 Comparison of Next-generation New Material Power Semiconductor Technologies
3.2 SiC Devices Will Replace Silicon-based IGBT
3.3 Development Trend of Power Semiconductor Devices in the Next 5-10 Years
3.4 Technical Performance and Applied Scenarios of SiC and GaN Power Devices
3.5 Much Lower Switching Loss of SiC Power Devices than IGBT
3.6 Global SiC Power Device Market Size and Competition between Key Vendors
3.7 Global SiC Power Semiconductor Market Size (by Application and Product)
3.8 Advantages and Applicable Fields of SiC and GaN
3.9 Enterprises in Global GaN Power Device Industry Chain

4. Global IGBT Companies

4.1 Infineon
4.1.1 Profile
4.1.2 Operation in 2019
4.1.3 Business Layout
4.1.4 IGBT Market Share
4.1.5 Automotive Electronic Product System
4.1.6 IGBT Iterations
4.1.7 Seventh-generation IGBT Product
4.1.8 Automotive IGBT Product System
4.1.9 Features of Automotive IGBT Modules
4.1.10 Automotive IGBT Single Tube System
4.1.11 Automotive IGBT Module System
4.1.12 Automotive Power Module Portfolio

4.1.17 Distribution of Main Customers
4.1.18 Dynamic of Power Semiconductors
4.2 Semikron
4.2.1 Profile
4.2.2 Global Operations
4.2.3 Power Semiconductor Product System
4.2.4 IGBT Product System
4.2.5 Automotive Power Semiconductors
4.2.6 Seventh-generation IGBT Product
4.2.7 SiC Technology
4.2.8 Dynamic of Power Semiconductors
4.3 Fuji Electric
4.3.1 Profile
4.3.2 Operation in 2019
4.3.3 Main Product System
4.3.4 IGBT Modules and Discretes
4.3.5 Application of IGBT Modules and Power Semiconductors
4.3.6 Evolution of IGBT and Chip Technologies
4.3.7 Seventh-generation IGBT Product Planning

4.3.15 Technical Direction and Planning
4.4 Mitsubishi Electric
4.4.1 Profile
4.4.2 Operation in 2019
4.4.3 Operations in the World and China
4.4.4 Product System
4.4.5 Power Semiconductor Product System and Main Products
4.4.6 Power Semiconductor Application
4.4.7 Seventh-generation IGBT T/T1 Series
4.4.8 Features of Seventh-generation IGBT T/T1 Series
4.4.9 Future Development Priorities and Goals of Semiconductor Business
4.4.10 Development Direction in the Automotive Field
4.4.11 Differentiation Strategy
4.5 ON Semiconductor
4.5.1 Profile
4.5.2 Operation in 2019 and Automotive Business Layout
4.5.3 Power Semiconductor Product System
4.5.4 Automotive Power Semiconductor and SiC Layout
..
4.5.8 Dynamic of Power Semiconductors
4.6 Denso
4.6.1 Profile
4.6.2 Operation in 2019
4.6.3 Global R&D Layout
4.6.4 Product System
4.6.5 IGBT Products and Application
4.6.6 Dynamic of Power Semiconductors
4.7 ROHM
4.7.1 Profile
4.7.2 Operation in 2019
4.7.3 Automotive Power Module Application System
4.7.4 Power Semiconductor Planning
4.7.5 SiC-MOSFET Product Planning
4.7.6 IGBT Products and Application
4.7.7 New-type IGBT Product
4.7.8 Next-generation SiC MOSFET Product
4.8 Hitachi
4.8.1 Profile
4.8.2 Operation in 2019
4.8.3 Goals of Power Modules
4.8.4 Power Module Development
4.8.5 Development History of Power Module Business
4.8.6 Advantages of IGBT Power Modules

4.8.14 Automotive SiC Modules
4.8.15 Power Semiconductors and Technologies
4.8.16 Latest Dynamics
4.9 Toshiba
4.9.1 Profile
4.9.2 Operation in 2019
4.9.3 Automotive Semiconductor Product System
4.9.4 Automotive MOSFET Product Series and Application
4.9.5 Automotive MOSFET Packaging Trend
4.9.6 IGBT Product Series and Application
4.9.7 Development History of IGBT
4.9.8 Power Device R & D Plan
4.10 Renesas
4.10.1 Profile
4.10.2 Operation in 2019
4.10.3 Automotive Industry Solutions and IGBT Product System
4.10.4 IGBT Products and Application
4.10.5 Application of IGBT for xEV Inverter Reference Solutions
4.10.6 IGBT Features and Its Use in Inverters
4.10.7 Eighth-generation IGBT
4.11 STMicroelectronics
4.11.1 Profile
4.11.2 Operation in 2019
4.11.3 IGBT Product System and Features
4.11.4 IGBT Modules and Application
4.11.5 IGBT Module Portfolio
4.12 Littelfuse
4.12.1 Profile
4.12.2 Global Operations
4.12.3 Automotive Semiconductor System
4.12.4 Automotive MOSFET
4.12.5 SiC MOSFET
4.13 Danfoss
4.13.1 Profile
4.13.2 IGBT Power Modules
4.13.3 Advanced Technology and Advantages of IGBT Power Module
4.13.4 Features of SiC-IGBT Technology
4.13.5 Automotive IGBT Modules
4.13.6 Dynamic of Power Semiconductors
4.14 Vishay
4.14.1 Profile
4.14.2 Semiconductor Product System
4.14.3 IGBT Product System and Main Products
4.14.4 Automotive MOSFET Product System

5. Chinese IGBT Companies

5.1 BYD Semiconductor
5.1.1 Profile
5.1.2 New Energy Sales Volume and Electronic Control System Installations
5.1.3 Products and Business
5.1.4 IGBT 4.0
5.1.5 IGBT Development Plan
5.1.6 Dynamic
5.2 StarPower
5.2.1 Profile
5.2.2 Product System Application Solution
5.2.3 Main IGBT Products
5.2.4 New Energy Vehicle IGBT Solution
5.2.5 IGBT Development History
5.2.6 Revenue and Customers
5.2.7 Latest Dynamics
5.3 Zhuzhou CRRC Times Electric
5.3.1 Profile
5.3.2 Core Technologies and Power Semiconductor Products
5.3.3 IGBT Product Application
5.3.4 Evolution of IGBT Technology
5.3.5 Automotive IGBT
5.4 Jiangsu MacMic Science & Technology
5.4.1 Profile
5.4.2 Main Products and Application
5.4.3 Solutions for Electric Vehicle
5.4.4 Solutions for Charging Pile
5.4.5 Dynamic
5.5 CAS-IGBT
5.5.1 Profile
5.5.2 Main IBGT Products and Application
5.5.3 Electric Vehicle Application Solution and Main Products
5.5.4 Automotive IGBT
5.5.5 Dynamic
5.6 Jilin Sino-Microelectronics
5.6.1 Profile
5.6.2 Product Line and Advantages
5.6.3 IGBT Products
5.6.4 Main IGBT Products
5.6.5 Latest Dynamic
5.7 HHGrace
5.7.1 Profile
5.7.2 IGBT Products and Application
5.7.3 Power Semiconductors and Wafer Technology Roadmap and Planning
5.8 Hangzhou Silan Microelectronics
5.8.1 Profile
5.8.2 Product System and Main Power Semiconductor Modules
5.8.3 Automotive IGBT Modules
5.8.4 Strategic Planning


Companies Mentioned:

Infineon
Semikron
Fuji Electric
Mitsubishi Electric
ON Semiconductor
Denso
ROHM
Hitachi
Toshiba
Renesas
STMicroelectronics
Littelfuse
Danfoss
Vishay
BYD Semiconductor
StarPower
Zhuzhou CRRC Times Electric
Jiangsu MacMic Science & Technology
CAS-IGBT
Jilin Sino-Microelectronics
HHGrace
Hangzhou Silan Microelectronics