I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
Impact of Covid-19 and a Looming Global Recession
Global Competitor Market Shares
Cloud EDA Competitor Market Share Scenario Worldwide (in %): 2018E

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Cloud EDA by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2018 through 2027

Table 2: World Historic Review for Cloud EDA by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 3: World 15-Year Perspective for Cloud EDA by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets
for Years 2012, 2018 & 2027

Table 4: World Current & Future Analysis for CAE by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2018 through 2027

Table 5: World Historic Review for CAE by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Sales in US$
Billion for Years 2012 through 2017

Table 6: World 15-Year Perspective for CAE by Geographic Region -
Percentage Breakdown of Value Sales for USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World for Years 2012,
2018 & 2027

Table 7: World Current & Future Analysis for SIP (Semiconductor
Intellectual Property) by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2018 through 2027

Table 8: World Historic Review for SIP (Semiconductor
Intellectual Property) by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2012 through 2017

Table 9: World 15-Year Perspective for SIP (Semiconductor
Intellectual Property) by Geographic Region - Percentage
Breakdown of Value Sales for USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World for Years 2012, 2018 & 2027

Table 10: World Current & Future Analysis for IC Physical
Design & Verification by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2018 through 2027

Table 11: World Historic Review for IC Physical Design &
Verification by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Sales in US$ Billion for Years 2012 through
2017

Table 12: World 15-Year Perspective for IC Physical Design &
Verification by Geographic Region - Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific
and Rest of World for Years 2012, 2018 & 2027

Table 13: World Current & Future Analysis for Printed Circuit
Board (PCB) & Multi-chip Module (MCM)) by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Sales in US$
Billion for Years 2018 through 2027

Table 14: World Historic Review for Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) by Geographic Region - USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2012 through 2017

Table 15: World 15-Year Perspective for Printed Circuit Board
(PCB) & Multi-chip Module (MCM)) by Geographic Region -
Percentage Breakdown of Value Sales for USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World for Years 2012,
2018 & 2027

Table 16: World Current & Future Analysis for Military/Defense
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2018 through 2027

Table 17: World Historic Review for Military/Defense by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2012 through 2017

Table 18: World 15-Year Perspective for Military/Defense by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2018 & 2027

Table 19: World Current & Future Analysis for Aerospace by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2018 through 2027

Table 20: World Historic Review for Aerospace by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 21: World 15-Year Perspective for Aerospace by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World for Years
2012, 2018 & 2027

Table 22: World Current & Future Analysis for Telecom by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2018 through 2027

Table 23: World Historic Review for Telecom by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 24: World 15-Year Perspective for Telecom by Geographic
Region - Percentage Breakdown of Value Sales for USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World for Years
2012, 2018 & 2027

Table 25: World Current & Future Analysis for Automotive by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2018 through 2027

Table 26: World Historic Review for Automotive by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 27: World 15-Year Perspective for Automotive by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2018 & 2027

Table 28: World Current & Future Analysis for Other
Applications by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Sales in US$ Billion for Years 2018 through
2027

Table 29: World Historic Review for Other Applications by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Sales in US$ Billion for Years 2012 through 2017

Table 30: World 15-Year Perspective for Other Applications by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2018 & 2027

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES
Market Facts & Figures
US Cloud EDA Market Share (in %) by Company: 2018 & 2027
Market Analytics
Table 31: USA Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 32: USA Historic Review for Cloud EDA by Product Segment -
CAE, SIP (Semiconductor Intellectual Property), IC Physical
Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 33: USA 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 34: USA Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 35: USA Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 36: USA 15-Year Perspective for Cloud EDA by Application -
Percentage Breakdown of Value Sales for Military/Defense,
Aerospace, Telecom, Automotive and Other Applications for the
Years 2012, 2018 & 2027

CANADA
Table 37: Canada Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 38: Canada Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 39: Canada 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 40: Canada Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 41: Canada Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 42: Canada 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

JAPAN
Table 43: Japan Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 44: Japan Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 45: Japan 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 46: Japan Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 47: Japan Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 48: Japan 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

CHINA
Table 49: China Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 50: China Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 51: China 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 52: China Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 53: China Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 54: China 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

EUROPE
Market Facts & Figures
European Cloud EDA Market: Competitor Market Share Scenario
(in %) for 2018 & 2027
Market Analytics
Table 55: Europe Current & Future Analysis for Cloud EDA by
Geographic Region - France, Germany, Italy, UK and Rest of
Europe Markets - Independent Analysis of Annual Sales in US$
Billion for Years 2018 through 2027

Table 56: Europe Historic Review for Cloud EDA by Geographic
Region - France, Germany, Italy, UK and Rest of Europe Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2012 through 2017

Table 57: Europe 15-Year Perspective for Cloud EDA by
Geographic Region - Percentage Breakdown of Value Sales for
France, Germany, Italy, UK and Rest of Europe Markets for Years
2012, 2018 & 2027

Table 58: Europe Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 59: Europe Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 60: Europe 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 61: Europe Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 62: Europe Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 63: Europe 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

FRANCE
Table 64: France Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 65: France Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 66: France 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 67: France Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 68: France Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 69: France 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

GERMANY
Table 70: Germany Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 71: Germany Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 72: Germany 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 73: Germany Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 74: Germany Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 75: Germany 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

ITALY
Table 76: Italy Current & Future Analysis for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 77: Italy Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 78: Italy 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 79: Italy Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 80: Italy Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 81: Italy 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

UNITED KINGDOM
Table 82: UK Current & Future Analysis for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) - Independent Analysis of Annual
Sales in US$ Billion for the Years 2018 through 2027

Table 83: UK Historic Review for Cloud EDA by Product Segment -
CAE, SIP (Semiconductor Intellectual Property), IC Physical
Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 84: UK 15-Year Perspective for Cloud EDA by Product
Segment - Percentage Breakdown of Value Sales for CAE, SIP
(Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 85: UK Current & Future Analysis for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications - Independent Analysis of Annual Sales
in US$ Billion for the Years 2018 through 2027

Table 86: UK Historic Review for Cloud EDA by Application -
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications Markets - Independent Analysis of Annual Sales in
US$ Billion for Years 2012 through 2017

Table 87: UK 15-Year Perspective for Cloud EDA by Application -
Percentage Breakdown of Value Sales for Military/Defense,
Aerospace, Telecom, Automotive and Other Applications for the
Years 2012, 2018 & 2027

REST OF EUROPE
Table 88: Rest of Europe Current & Future Analysis for Cloud
EDA by Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 89: Rest of Europe Historic Review for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2012 through 2017

Table 90: Rest of Europe 15-Year Perspective for Cloud EDA by
Product Segment - Percentage Breakdown of Value Sales for CAE,
SIP (Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 91: Rest of Europe Current & Future Analysis for Cloud
EDA by Application - Military/Defense, Aerospace, Telecom,
Automotive and Other Applications - Independent Analysis of
Annual Sales in US$ Billion for the Years 2018 through 2027

Table 92: Rest of Europe Historic Review for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Billion for Years 2012 through 2017

Table 93: Rest of Europe 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

ASIA-PACIFIC
Table 94: Asia-Pacific Current & Future Analysis for Cloud EDA
by Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 95: Asia-Pacific Historic Review for Cloud EDA by Product
Segment - CAE, SIP (Semiconductor Intellectual Property), IC
Physical Design & Verification and Printed Circuit Board (PCB) &
Multi-chip Module (MCM)) Markets - Independent Analysis of
Annual Sales in US$ Billion for Years 2012 through 2017

Table 96: Asia-Pacific 15-Year Perspective for Cloud EDA by
Product Segment - Percentage Breakdown of Value Sales for CAE,
SIP (Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 97: Asia-Pacific Current & Future Analysis for Cloud EDA
by Application - Military/Defense, Aerospace, Telecom,
Automotive and Other Applications - Independent Analysis of
Annual Sales in US$ Billion for the Years 2018 through 2027

Table 98: Asia-Pacific Historic Review for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Billion for Years 2012 through 2017

Table 99: Asia-Pacific 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

REST OF WORLD
Table 100: Rest of World Current & Future Analysis for Cloud
EDA by Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent
Analysis of Annual Sales in US$ Billion for the Years 2018
through 2027

Table 101: Rest of World Historic Review for Cloud EDA by
Product Segment - CAE, SIP (Semiconductor Intellectual
Property), IC Physical Design & Verification and Printed
Circuit Board (PCB) & Multi-chip Module (MCM)) Markets -
Independent Analysis of Annual Sales in US$ Billion for Years
2012 through 2017

Table 102: Rest of World 15-Year Perspective for Cloud EDA by
Product Segment - Percentage Breakdown of Value Sales for CAE,
SIP (Semiconductor Intellectual Property), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-chip
Module (MCM)) for the Years 2012, 2018 & 2027

Table 103: Rest of World Current & Future Analysis for Cloud
EDA by Application - Military/Defense, Aerospace, Telecom,
Automotive and Other Applications - Independent Analysis of
Annual Sales in US$ Billion for the Years 2018 through 2027

Table 104: Rest of World Historic Review for Cloud EDA by
Application - Military/Defense, Aerospace, Telecom, Automotive
and Other Applications Markets - Independent Analysis of Annual
Sales in US$ Billion for Years 2012 through 2017

Table 105: Rest of World 15-Year Perspective for Cloud EDA by
Application - Percentage Breakdown of Value Sales for
Military/Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2012, 2018 & 2027

IV. COMPETITION
Total Companies Profiled: 48