The 2022 Report on Packaging Equipment and Other Parts for Semiconductor Manufacturing Machinery: World Market Segmentation by City

The 2022 Report on Packaging Equipment and Other Parts for Semiconductor Manufacturing Machinery: World Market Segmentation by City

  • July 2021 •
  • 525 pages •
  • Report ID: 1954324 •
  • Format: PDF
This report was created for global strategic planners who cannot be content with traditional methods of segmenting world markets. With the advent of a "borderless world", cities become a more important criteria in prioritizing markets, as opposed to regions, continents, or countries. This report covers the top 2,000 cities in over 200 countries. It does so by reporting the estimated market size (in terms of latent demand) for each major city of the world. It then ranks these cities and reports them in terms of their size as a percent of the country where they are located, their geographic region (e.g. Africa, Asia, Europe, Middle East, North America, Latin America), and the total world market.

This study covers packaging equipment and other parts for semiconductor manufacturing machinery as defined by the North American Industrial Classification system or NAICS (pronounced "nakes").

The NAICS code for packaging equipment and other parts for semiconductor manufacturing machinery is 33329505. It is for this definition that aggregate latent demand estimates are derived. Packaging equipment and other parts for semiconductor manufacturing machinery is specifically defined as follows:

33329505 Parts for semiconductor manufacturing machinery, including packaging equipment

33329505A1 Parts for ion implanters used for doping semiconductor wafers

33329505A6 Parts for apparatus used for the projection of circuit patterns on sensitized semiconductor materials

33329505B1 Parts for pattern generating apparatus used to produce masks and reticles from photoresist coated substrates

33329505B6 Other parts for semiconductor manufacturing machinery

3332950581 Packaging equipment, including mold and seal equipment and finish and mark equipment

3332950586 Other assembly and packaging equipment, including lead frame inserting machines

3332950591 Parts for machine tools used to produce and process semiconductor wafers

3332950596 Parts for ion beam and plasma machines used to process semiconductor wafers and designs by removal of material

This study covers the world outlook for packaging equipment and other parts for semiconductor manufacturing machinery across more than 2,000 cities. For the year reported, estimates are given for the latent demand, or potential industry earnings (P.I.E.), for the city in question (in millions of U.S. dollars), the percent share the city is of the region, and of the globe. These comparative benchmarks allow the reader to quickly gauge a city vis-à-vis others. Using econometric models which project fundamental economic dynamics within each country and across countries, latent demand estimates are created. This report does not discuss the specific players in the market serving the latent demand, nor specific details at the product level. The study also does not consider short-term cyclicalities that might affect realized sales. The study, therefore, is strategic in nature, taking an aggregate and long-run view, irrespective of the players or products involved.

This study does not report actual sales data (which are simply unavailable, in a comparable or consistent manner in virtually all of the cities of the world). This study gives, however, Professor Parker’s estimates for the worldwide latent demand, or the P.I.E., for packaging equipment and other parts for semiconductor manufacturing machinery. It also shows how the P.I.E. is divided across the world’s cities. In order to make these estimates, a multi-stage methodology was employed that is often taught in courses on international strategic planning at graduate schools of business.