This IDC study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2014-2019. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, 3.5G, and 4G technologies; by major semiconductor device type; and by geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast with the prior forecast is also noted.
"Worldwide mobile phone semiconductor revenue grew by 11% in 2014 to reach $83.8 billion. By 2019, mobile phone semiconductor revenue will cross the $100 billion milestone. A number of factors are at play in the market including a move to in-house silicon by major smartphone OEMs, pricing pressure in the low-end segment of the market, an upgrade cycle to higher functionality and premium smartphones in the Chinese market, added functionality to the silicon BOM in the form of increased NAND and DRAM content, increasing attach rate of fingerprint and motion sensors, and sensor hubs and connectivity such as NFC and Bluetooth LE." -- Les Santiago, research director, Enabling Technologies: Mobile and Tablets