Opportunities for the Global High Temperature Adhesives Market 2016-2021: Trends, Forecast, and Opportunity Analysis, April 2016

Opportunities for the Global High Temperature Adhesives Market 2016-2021: Trends, Forecast, and Opportunity Analysis, April 2016

  • April 2016 •
  • 143 pages •
  • Report ID: 3871143
Background:

According to a new market report published by Lucintel, the future of the global high temperature adhesives market looks attractive with growing electrical and electronics market and rising automotive production. The global high temperature adhesives market is forecast to grow at a CAGR of 4% from 2016 to 2021. The major growth drivers for this market are the growth in electrical and electronics industry, and increasing automotive production. The printed circuit board (PCBs) makes the use of high temperature adhesives in the bonding of surface mount-components, wire tacking, and potting and encapsulating electronic components. In this market, epoxy, silicone, acrylic, and other high temperature adhesives are used for electrical and electronics, automotive, aerospace, marine, and construction applications.

Lucintel predicts that the demand for epoxy based high temperature adhesive is expected to remain the largest segment due to its ability to withstand higher temperatures of up to 200 degree Celsius. On the basis of its comprehensive research, Lucintel forecasts that the epoxy based high temperature adhesive are expected to depict highest growth during the forecast period as they provide excellent adhesion, versatility, good electrical properties, compatibility, resistance to weathering, and ease of application that can readily be tailored according to the demand of manufacturers. Within the high temperature adhesives market, the electrical and electronics segment is expected to remain the largest segment by value and volume consumption. Growing demand for PCBs from telecommunication, computer/peripherals, consumer, and microelectronic assembly applications, miniaturization of IC chips, and a rapid move towards smaller and higher-performance electronic devices is expected to spur growth for this segment over the forecast period. Asia Pacific is expected to remain the largest market due to an increase in the production of printed circuit board in China, Taiwan, Japan, and South Korea and the use of high temperature adhesives in the assembly and packaging of electronic circuits.

North America and Rest of the World are expected to witness significant growth over the forecast period due to new technological developments will be explored by high temperature adhesive manufacturers to meet consumers’ demand. For market expansion, the report suggests innovation and new product development, where the unique features of high temperature adhesives can be capitalized. The report further suggests the development of partnerships with customers to create win-win situations and the development of lowcost solutions for end users. Emerging trends, which have a direct impact on the dynamics of the market, includes the new siliconebased electrically conductive adhesives in automotive sensor applications, development of fast cure and high temperature resistant adhesives, and replacement of lead solder with electrically conductive adhesives.

Henkel AG & Co KGaA, 3M Company, Avery Dennison Corporation, Master Bond Inc., and Permabond are among the major suppliers of high temperature adhesives. There are some companies that are opting for merger & acquisition as strategic initiatives for driving growth. Lucintel, a leading global strategic consulting and market research firm, has analyzed the global high temperature adhesives market by application type, polymer type, technology type, product form and region, has come up with a comprehensive research report, “Opportunities for the Global High Temperature Adhesives Market 2016-2021: Trends, Forecast, and Opportunity Analysis” The Lucintel report serves as a springboard for growth strategy, as it provides a comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global high temperature adhesives market through 2021, segmented by application type, polymer type, technology type, product form and region, as follows:

By application type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
• Electrical and electronics
• Automotive
• Aerospace
• Others (Marine and Construction) By polymer type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
• Epoxy based high temperature adhesive
• Silicone based high temperature adhesive
• Acrylic based high temperature adhesive
• Other high temperature adhesive (Polyamide and polyolefin) By technology type [$ Million shipment from 2010 to 2021]:
• Reactive • Solvent based
• Hot Melt
• Film By region [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
• North America
• Europe
• Asia Pacific
• Rest of World By product form [$ Million shipment for 2015]:
• Paste
• Liquid
• Film

This report answers following 11 key questions:

Q. 1 How big the opportunities for high temperature adhesives market by applications and regions? Q. 2. Which segments will grow at a faster pace and why?
Q. 3. Which region will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5. What are the business risks and threats of this market?
Q.6 What are emerging trends in this market and reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are taken by key players for business growth?
Q.10 How is the competitive rivalry and threat of substitution in this market?
Q.11. How many M & A activities happened during last 1- 2 years and what are their impacts?