Semiconductor Metallization and Interconnects: Technologies and Global Markets

Semiconductor Metallization and Interconnects: Technologies and Global Markets

  • June 2016 •
  • 211 pages •
  • Report ID: 3922376 •
  • Format: PDF
This BCC Research report measures and analyzes the global market for semiconductor metallization. It includes factors currently driving and restraining growth in this market, as well as those with an impact on the future of the industry. Forecast included through 2020.

Use this report to:

Gain insight into the global semiconductor metallization and interconnects market broken down into various segments such as technology, application, components used, region, metallization process, and interconnect materials.
Identify current trends and factors which are driving and restraining growth.
Analyze relevant patent data, and a list of key corporate players and their company profiles.

Highlights

The global semiconductor metallization and interconnects market totaled $912.8 million and $1.0 billion in 2014 and 2015 respectively.
The market should total nearly $1.8 billion by 2020, growing at a compound annual growth rate (CAGR) of 11.4% from 2015 to 2020. The market for consumer electronics totaled $377.9 million in 2014 and $428.3 million in 2015.
The market should total $739.1 million by 2020, at a CAGR of 11.5% from 2015 to 2020.
The semiconductor metallization and interconnects segment for medical and healthcare totaled $112.9 million in 2015, and should total $196.3 million in 2020, growing at a CAGR of 11.7% from 2015 to 2020.

STUDY GOALS AND OBJECTIVES

This report measures and analyzes the global market for semiconductor metallization. The report includes factors currently driving and restraining growth in this market, as well as those with an impact on the future of the industry. The goals and objectives of this report are the following:

To understand opportunities and highlights of the innovation-driven semiconductor metallization market and the major regions and countries of the market.
To analyze various technologies used in the semiconductor metallization process and determine the dynamics of each technology.
To analyze various processes used in semiconductor metallization and determine the dynamics of each of these processes.
To analyze the various interconnecting materials used in semiconductor metallization processes and determine various factors driving and restraining the demand of each of these interconnecting materials.
To analyze the various components used for semiconductor metallization and determine their future growth potential.
To identify segments with high growth potential and understand future application sectors within these segments.

To examine key trends and regional factors related to technology, process, interconnecting material, components and applications that shape and influence the overall market for semiconductor metallization.
To examine region-specific developments in the market.
To understand the major stakeholders in the market and the competitive landscape for market leaders.
To analyze growth strategies of key players in the semiconductor metallization market.
To analyze patent data where relevant

REASONS FOR CONDUCTING THE STUDY

Semiconductor metallization is an integral part of the semiconductor manufacturing process. Increasing demand for tablets, smart phones and smart wearable devices among others is one of the major factors fueling the demand globally for semiconductor metallization. Metallization is the final step in the wafer processing sequence. Metallization is the process by which the components of IC’s are interconnected by aluminum conductor.

This process produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip. Another use of metallization is to produce metallized areas called bonding pads around the periphery of the chip to produce metallized areas for the bonding of wire leads from the package to the chip. The bonding wires are typically 25 micrometer-diameter gold wires, and the bonding pads are usually made to be around 100×100 micrometers square to accommodate fully the flattened ends of the bonding wires and to allow for some registration errors in the placement of the wires on the pads.