Global Probe Card Market: Size, Trends & Forecasts (2019-2023 Edition)

Global Probe Card Market: Size, Trends & Forecasts (2019-2023 Edition)

  • October 2019 •
  • 55 pages •
  • Report ID: 4465417 •
  • Format: PDF
Scope of the Report
The report titled “Global Probe Card Market: Size, Trends & Forecasts (2019-2023 Edition)” provides an in-depth analysis of the global probe card market with detailed analysis of the market by value, volume and by segments. The report provides detailed regional analysis of Asia-Pacific, including the forecast of the market for the period 2019-2023. Taiwan, Japan, China are leading manufacturers of the product in the region.

Growth of the global probe card market has also been forecasted for the period 2019-2023, taking into consideration the previous growth patterns, the growth drivers and the current and future trends.

The global probe card market is highly consolidated as a few leading vendors hold the majority of market shares. The market has high entry barriers owing to the highly consolidated nature of the market and the requirement of technical expertise. It is anticipated that the vendors with cheaper and technologically advanced testing solutions will be able to capture a greater market share during the forecast period.

Further, key players of the global probe card market are FormFactor, Japan Electronic Materials Corporation and Micronics Japan Co., Ltd. whose company profiling has been done in the report. In this section of the report, business overview, financial overview and business strategies of the companies have been provided.

Company Coverage
Form Factor Inc.
Micronics Japan Co.,Ltd
Japan Electronic Materials Corporation

Company Coverage
Asia Pacific

Executive Summary
Wafer testing performed by semiconductor producer is done with the help of test equipment devices that are called probe cards. Probe cards are the testing devices used by semiconductor manufacturers to perform wafer test on semiconductor die and chips. Traditional probe cards contact just a part of the wafer, requiring various touchdowns to test the whole wafer. There has been improvements in designs to suit a wide range of contactor technologies so that the contactor technology can develop according to the necessities of the customers.

The global probe card market increased at a significant CAGR during the span of four years, i.e. 2013-2018 and projections are made that the market would rise in the next five years i.e. 2019-2023, tremendously. The market can be segmented, on the basis of technology into: blade/tungsten, epoxy/cantilever, vertical probe and MEMS. The probe card market segmentation is also done on the basis of device into Foundry & Logic, DRAM, Flash and Engineering Systems. The market is bifurcated into advanced and traditional/ standard probe card on the basis of product type.

The growth drivers for the global probe card market are: emergence of TSV technology, the prevalence of miniaturization, rise in the semiconductor market and LED market. Despite the market is governed by various growth drivers, there are certain challenges faced by the market such as: continuous price pressure on vendors, cyclical nature of the semiconductor industry, and limited number of suppliers.

Some of the recent trends in the market include developments in the semiconductor market & LED market relating to probe cards, transition from cantilever probe cards to advanced probe cards and the emerging strong players.

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