Adhesives for Microfluidics- Technology Assessment

Adhesives for Microfluidics- Technology Assessment

  • December 2016
  • 81 pages
  • Frost & Sullivan
Report ID: 4595310
Adhesives for wafer-scale bonding is expected to impact the future of next-generation microfluidic devices

With the boom of the micro-electromechanical systems (MEMS) industry in the last 3 to 5 years, wafer bonding and packaging have become a significant area of interest for the fabrication of the different types of MEMS devices. Among various fabrication techniques, wafer bonding with intermediate adhesives is an important technique as in comparison to other fabrication techniques, adhesive bonding is cost effective, robust, and simple. In adhesive wafer bonding, the adhesive is capable to hold both wafer surfaces together.


Adhesive wafer bonding is preferred over other methods because of technical attributes such as insensitivity to surface topography, low bonding temperatures, compatibility with standard integrated circuit wafer processing, and ability to join different types of wafers. This research service provides:a snapshot of various adhesives and capabilities for MEMS wafer fabrication, impact analysis and assessment of recent innovations, a detailed analysis of technology and business accelerators and challenges in adhesives for microfluidic devices, an assessment of technology adoption focusing on the global hotspots and an evaluation of emerging opportunities and adoption roadmap that helps identify the year of impact of various adhesives
1.1.0 Executive Summary
 
1.0 Executive Summary
1.1 Research Scope
1.2 Research Process and Methodology
1.3 Key Findings
 
2.2.0 Technology Snapshot
 
2.0 Technology Snapshot
2.1 Adhesives for wafer-level bonding in microfluidics
2.2 Conformal adherence and tailored surface chemistry are key requirements of adhesives
2.3 Continuous, droplet, and digital microfluidics continue to remain the key microfluidics
2.4 Spin coating is most commonly used for application of adhesives
2.5 Adhesive bonding is still one of the most significant wafer-bonding techniques
2.6 MEMS continue to be the most attractive area for adhesive bonding processes
2.7 Patterned form of adhesive bonding offers selectivity and localized adhesive application
2.8 Steady rise in innovations related to adhesive bonding
2.9 Adhesive bonding follows a step-by-step process from surface cleaning to final bonding
2.10 Epoxy and silicones are key materials preferred for wafer-scale bonding
2.11 PDMS and silicones offer very high opportunities to demonstrate durability and high adhesion
2.12 Use of silicones as adhesives can reduce the non-bonded area
2.13 Healthcare and pharmaceuticals will have highest potential for microfluidics in short term
2.14 Chemicals and personal care are considered emerging areas for microfluidics
2.15 MEMS and optoelectronics are considered most attractive segments for wafer bonding process
 
3.3.0 Impact Assessment of Adhesives for Microfluidics
 
3.0 Impact Assessment of Adhesives for Microfluidics
3.1 Growing healthcare market is the main driver for adhesives in microfluidics
3.2 Foundries and original equipment manufacturers (OEM) are the key decision makers in the microfluidics value chain
3.3 North American and European end-user companies are keen to partner with Asia-Pacific foundries
 
4.4.0 Innovation Ecosystem
 
4.0 Innovation Ecosystem
4.1 Widespread research activity across the innovation ecosystem
4.2 Adhesive innovations in the pharmaceutical industry
4.3 Adhesive innovations for diagnostic applications
4.4 Adhesive innovations for other application industries
4.5 Key microfluidic device innovations in the pharmaceutical industry
4.6 Key microfluidic device innovations for clinical diagnostics
4.7 Key microfluidic device innovations for point of care diagnostics
 
5.5.0 Technology Development and Adoption Trends
 
5.0 Technology Development and Adoption Trends
5.1 Ease of bonding and good self-healing properties are two primary focus areas in terms of R&D
5.2 USPTO finds the highest number of patent applications in the microfluidics space
5.3 Silicone adhesives are prominent in patent filings in 2015
5.4 Epoxy adhesives find the highest number of patent filings in the last few years in wafer-scale bonding
5.5 Adhesives for microfluidics gaining research interest across the globe
5.6 Pharmaceutical, drug delivery, diagnostics, assays, and optics are some of the highly emerging areas for microfluidics
5.7 LOC devices and diagnostics represent key opportunities for adhesive development
5.8 Increasing R&D focusing on adhesives for microfluidics facilitates new product development
5.9 R&D initiatives are focused toward development of newer adhesive and bonding technologies to develop better designed MEMS and ICs
 
6.6.0 Opportunity Evaluation
 
6.0 Opportunity Evaluation
6.1 Healthcare is the most significant industry for adhesives in the microfluidics space
6.2 Microfluidic technologies in the chemicals and food industry are still in the R&D phase
6.3 Microfluidics will grow exponentially in the electronics industry
6.4 Microfluidics will have high potential in the biotechnology and energy industries in the mid term
6.5 Opportunities for adhesives in wafer bonding for the electronics sector
6.6 Opportunities for adhesives for wafer bonding in the healthcare sector
 
7.7.0 Growth Opportunities
 
7.0 Growth Opportunities
7.1 Growth opportunity : microfluidics in the healthcare space — new capabilities
7.2 Growth opportunity : microfluidics in the healthcare space — geographic expansion
7.3 Growth opportunity : microfluidics in the life sciences applications — vertical markets
7.4 Growth opportunity : microfluidics in the life sciences applications —new capabilities
7.5 Growth opportunity : microfluidics in electronics — disruptive applications
7.6 Growth opportunity: microfluidics in electronics — value-add services
7.7 Strategic imperatives for success and growth
 
8.8.0 Key Patents
 
8.0 Key Patents
8.1 Key Patents

9.9.0 Key Contacts
 
9.0 Key Contacts
9.1 Key Contacts

Legal Disclaimer
 
10.10.0 Appendix
 
10.0 Appendix
10.1 Ratings of OSE Matrix
10.2 Final Ratings of OSE
Industry=Chemical ParentIndustry=HeavyIndustry Date=201612 Topic=MarketReport Publisher=Frost&Sullivan Price=5000