Die bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step. bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step.
Technavio’s analysts forecast the global die bonder equipment market to grow at a CAGR of 2.28% during the period 2017-2021.
Covered in this report The report covers the present scenario and the growth prospects of the global die bonder equipment market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography: - Americas - APAC - EMEA
Technavio's report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Other prominent vendors - Besi - DIAS Automation - Hesse - Hybond - SHINKAWA - Toray Engineering - West-Bond
Market driver - Demand for high-quality semiconductor ICs for wireless devices and IoT applications. - For a full, detailed list, view our report
Market challenge - High demand for polymer adhesive wafer bonding equipment. - For a full, detailed list, view our report
Market trend - Increase in M&A in the semiconductor packaging and assembly market. - For a full, detailed list, view our report
Key questions answered in this report - What will the market size be in 2021 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors?
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Methodology Research methodology is based on extensive primary and secondary research. Primary research includes in-depth interviews with industry experts, vendors, resellers and customers. Secondary research includes Technavio Platform, industry publications, company reports, news articles, analyst reports, trade associations and the data published by Government agencies.
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