Global Wire Bonder Equipment Market 2017-2021

Global Wire Bonder Equipment Market 2017-2021

  • May 2017 •
  • 70 pages •
  • Report ID: 4921227
About Wire Bonder Equipment

Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.

Technavio’s analysts forecast the global wire bonder equipment market to grow at a CAGR of 2.88% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global wire bonder equipment market for 2017-2021. To calculate the market size, the report considers the new installations, shipments, and sales of wire bonding systems in the semiconductor market.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Wire Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
• ASM Pacific Technology
• Kulicke& Soffa
• Palomar Technologies

Other prominent vendors
• Besi
• DIAS Automation
• F&K Delvotec Bondtechnik
• Hesse
• Hybond
• SHINKAWA Electric
• Toray Engineering
• West Bond

Market driver
• Incentives and discounts for long-term customers
• For a full, detailed list, view our report

Market challenge
• High investment market
• For a full, detailed list, view our report

Market trend
• Growing use of 3D chip packaging
• For a full, detailed list, view our report

Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

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Country=World Industry=Semiconductor ParentIndustry=HeavyIndustry Date=201705 Topic=Forecast Publisher=InfinitiResearchLimited Price=3000