Global ESD Packaging Industry

Global ESD Packaging Industry

  • October 2019 •
  • 105 pages •
  • Report ID: 5798535 •
  • Format: PDF
ESD Packaging market worldwide is projected to grow by US$1.8 Billion, driven by a compounded growth of 7%. Communication Network Infrastructure, one of the segments analyzed and sized in this study, displays the potential to grow at over 8%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$1.6 Billion by the year 2025, Communication Network Infrastructure will bring in healthy gains adding significant momentum to global growth.

- Representing the developed world, the United States will maintain a 8% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$81.7 Million to the region’s size and clout in the next 5 to 6 years. Over US$85.2 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, Communication Network Infrastructure will reach a market size of US$149.3 Million by the close of the analysis period. As the world’s second largest economy and the new game changer in global markets, China exhibits the potential to grow at 6.7% over the next couple of years and add approximately US$310.1 Million in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

- Competitors identified in this market include, among others, Akzo Nobel NV; BASF SE; DaklaPack Group; Desco Industries Inc.; Dou Yee Technologies Pte., Ltd.; DowDuPont, Inc.; GWP Group; Miller Supply Inc.; Polyplus Packaging Ltd.; PPG Industries, Inc.; TIP Corporation Sdn Bhd.; Uline