Global Semiconductor Advanced Packaging Industry

March 2022 •
488 pages •
Report ID: 5900276 •
Format: PDF

Summary
Table of contents

Abstract:
What’s New for 2022?

- Global competitiveness and key competitor percentage market shares
- Market presence across multiple geographies - Strong/Active/Niche/Trivial
- Online interactive peer-to-peer collaborative bespoke updates
- Access to our digital archives and MarketGlass Research Platform
- Complimentary updates for one yearGlobal Semiconductor Advanced Packaging Market to Reach US$53.2 Billion by the Year 2027

- Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$31.8 Billion in the year 2020, is projected to reach a revised size of US$53.2 Billion by 2027, growing at a CAGR of 7.6% over the analysis period 2020-2027.Flip Chip Packaging, one of the segments analyzed in the report, is projected to grow at a 7.2% CAGR to reach US$39.1 Billion by the end of the analysis period.After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.1% CAGR for the next 7-year period. This segment currently accounts for a 9.8% share of the global Semiconductor Advanced Packaging market.

- The U.S. Accounts for Over 9.5% of Global Market Size in 2020, While China is Forecast to Grow at a 9.3% CAGR for the Period of 2020-2027

- The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3 Billion in the year 2020. The country currently accounts for a 9.46% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$15 Billion in the year 2027 trailing a CAGR of 9.3% through 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR while Rest of European market (as defined in the study) will reach US$15 Billion by the year 2027.

- FI WLP Segment Corners a 7.6% Share in 2020

- In the global FI WLP segment, USA, Canada, Japan, China and Europe will drive the 6.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$19.3 Billion by the year 2027.

- Select Competitors (Total 109 Featured) Advanced Semiconductor Engineering, Inc. Amkor Technology, Inc. ChipMOS Technologies Inc. FlipChip International LLC HANA Micron Inc. ISI - Interconnect Systems JCET Group King Yuan Electronics Co., Ltd. NEPES Powertech Technology Inc. Samsung Signetics Taiwan Semiconductor Manufacturing Company Limited Veeco Instruments Inc.

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