Global Wafer-level Packaging Equipment Market to Reach $12.1 Billion by 2027
Amid the COVID-19 crisis, the global market for Wafer-level Packaging Equipment estimated at US$3.8 Billion in the year 2020, is projected to reach a revised size of US$12.1 Billion by 2027, growing at a CAGR of 18.2% over the period 2020-2027.
The U.S. Market is Estimated at $1 Billion, While China is Forecast to Grow at 23.4% CAGR
The Wafer-level Packaging Equipment market in the U.S. is estimated at US$1 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$2.9 Billion by the year 2027 trailing a CAGR of 23.4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 13.1% and 16.1% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 14.4% CAGR.We bring years of research experience to this 9th edition of our report. The 97-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.Competitors identified in this market include, among others,
- Applied Materials, Inc.
- Disco, Inc.
- EV Group
- Rudolph Technologies, Inc.
- Semes Co., Ltd.
- Suss MicroTec AG
- ULVAC Technologies, Inc.