The Global Mixed Signal IC Market size is expected to reach $141.5 billion by 2026, rising at a market growth of 7.6% CAGR during the forecast period. A mixed IC is considered as the combination of digital and analog IC on a single chip. Using these ICs, analog signals like light, sound, and heat can be converted into digital signals for processing electronic products. Mixed-signal ICs find considerable applications in automotive, security & surveillance, consumer electronics, communications, healthcare, IoT, and industrial equipment. Due to their dual ability, these ICs are extensively adopted in order to convert analog into digital and digital into analog.
One of the major drivers for the market growth includes its’ high demand in test & measurement devices. Mixed-signal ICs are increasingly being used for test & measurement instruments like digital oscilloscope, weigh use, spectrum analyzers, and precision measurement. Using mixed-signal ICs, manufacturers of the electronics industry can develop highly accurate components and devices, which are highly demanded from OEMs. Mixed-signal ICs play an important role in test and measurement systems as the data processing rate is high while at the same time keeping high accuracy. With the help of mixed-signal ICs, it becomes easier to transform analog signals into a digital image/signal that further aids in making the accurate decision.
The COVID-19 pandemic caused disturbances in the supply chain, a shutdown of business, uncertain scenarios in the stock market, and expands the panic situation among customer segments. The COVID-19 pandemic severely impacted the manufacturing process of various industries such as semiconductors & electronics. The demand & supply chain is further disrupted by trade barriers. Administrations of various countries have imposed strict lockdown regulations and have close down industries on a temporary basis, which negatively impacted the overall manufacturing process.
Based on Type, the market is segmented into Mixed Signal SoC, Microcontroller and Data Converter. In 2019, the mixed-signal SoC segment acquired the major revenue share. This is because mixed-signal SoCs find potential application across various end-use industries like consumer electronics, IT & telecommunication, military & defense, medical & healthcare, and automotive. In addition, the adoption of mixed-signal SoCs is significantly boosted by its low power consumption. Using mixed-signal SoC, not only the size but also the power consumption can be reduced. As a result, the reliability of the overall framework gets superior, which is a major factor behind its adoption.
End User Outlook
Based on End User, the market is segmented into Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Others. On the basis of end-use, the consumer electronics segment procured the maximum revenue of the global mixed-signal IC market in 2019. There is high adoption of mixed-signal IC in mobile phones and electronics, due to substantial development of the telecommunication, electronics, and other industries. The global mixed-signal IC market is expected to grow due to the advent of the 5G network & high demand for low-power consumption devices.
Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. In 2019, North America emerged as one of the leading regions; although, the market in the Asia-Pacific region is anticipated to develop at a quick rate in comparison to other regions. The growth of the Asia-Pacific market is estimated to be fuelled due to the factors like a surge in demand for consumer applications, high adoption of 5G technology, and low power consumption by mixed-signal ICs.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments, Inc., Intel Corporation, Telephonics Corporation (Griffon Corporation), and Ensilica Limited.
Strategies deployed in High Performance Computing (HPC) Chipset Market
Jan-2021: Intel launched the new N-series 10-nanometer Intel Pentium Silver and Intel Celeron processors. These processors provide an unmatched balance of performance, media and collaboration for education systems.
Nov-2020: IBM signed a joint development agreement with AMD for enhancing and extending the security and Artificial Intelligence (AI) offerings of both the companies. The agreement aimed to expand this vision by building upon open-source software, open standards, and open system architectures for driving ’confidential computing’ in hybrid cloud environments.
Oct-2020: AMD completed the acquisition of Xilinx, an American technology company. Both the companies would merge to create a new high-performance computing company. Xilinx’s technology would be integrated into AMD’s products for actualizing a highly integrated CPU+FPGA solution.
Sep-2020: NVIDIA agreed to acquire British chip designer Arm, from SoftBankWe. The acquisition aims to maintain its open-licensing model and customer neutrality, offering customers in any industry, across the world, and would further expand Arm’s IP licensing portfolio with NVIDIA’s world-leading GPU and AI technology.
Nov-2019: Intel introduced the new GPU Architecture with High-Performance Computing and AI Acceleration, and oneAPI Software Stack with Unified and Scalable Abstraction for Heterogeneous Architectures. The company launched its vision for accelerating its leadership in the convergence of high-performance computing (HPC) and artificial intelligence (AI) with new additions to its data-centric silicon portfolio and a new software initiative.
Jun-2019: AMD came into partnership with Samsung Exynos. Following this partnership, Samsung licensed AMD’s Radeon graphics technologies for use in mobile applications including smartphones. Samsung uses ultra-low power high-performance mobile graphics IP based on AMD Radeon graphics technologies for use in its devices.
Scope of the Study
Market Segments covered in the Report:
• Mixed Signal SoC
• Data Converter
By End User
• Consumer Electronics
• Medical & Healthcare
• North America
o Rest of North America
o Rest of Europe
• Asia Pacific
o South Korea
o Rest of Asia Pacific
o Saudi Arabia
o South Africa
o Rest of LAMEA
• Broadcom, Inc.
• Infineon Technologies AG
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• STMicroelectronics N.V.
• Texas Instruments, Inc.
• Intel Corporation
• Telephonics Corporation (Griffon Corporation)
• Ensilica Limited
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