Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Platform, Application, and Industry, Geography

Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Platform, Application, and Industry, Geography

  • March 2021 •
  • 158 pages •
  • Report ID: 6063390 •
  • Format: PDF
The embedded die packaging technology market was valued at US$ 63.40 million in 2020 and is projected to reach US$ 242.80 million by 2028. The embedded die packaging technology market is expected to grow at a CAGR of 18.6% during the forecast period of 2021 to 2028.

The COVID-19 outbreak has negatively affected the overall growth rate of global embedded die packaging technology market in the year 2020 to some extent.This can be attributed to decline in revenue and growth of companies operating in the market owing to supply and demand disruptions across the semiconductor and advanced packaging industry value chain.

Also, in 2019, the growth rate saw a decline due to sluggish growth of the semiconductor industry, low mobile phone demand, and trade wars. However, the high growth prospects from applications of embedded die packaging in automotive and medical sectors would help in normalizing the market growth over the forecast period of 2021 to 2028.

The global embedded die packaging technology market has been segmented into four major regions—North America, Europe, APAC and Rest of the World. In 2020, APAC led the global embedded die packaging technology market with 50.5% revenue share. The North America region has a strong penetration of advanced electronics devices compatible with advanced networking systems. Also, the Asian market is witnessing massive growth in embedded die packaging technology, owing to increased adoption of smartphones and wearable devices. In developing countries such as India and China the market is driven by the growing consumption of smartphones and medical devices. Therefore, the adoption of embedded die packaging technology due to increasing miniaturization of electronic devices and demand of small form factor based electronics. China is one of the major countries which has a significant market share in the embedded die packaging technology market. European countries such as the UK, Italy, are France are shifting toward digitalization and automation, which is driving the market.

In North America, the US is the most developed country.The US country is an early adopter of technologies.

The scope of newly developed compact electronics is high in the North America region.The adoption rate of IoT technology, high-end smartphones, and other devices is higher in the US than other North American countries.

This factor encourages embedded die packaging technology providers to increase their focus to develop or innovate embedded die packaging technology for a wide range of applications.

The overall embedded die packaging technology market size has been derived using both primary and secondary sources.To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the embedded die packaging technology market.

The process also serves the purpose of obtaining an overview and forecast for the Embedded Die Packaging Technology market with respect to all the segments.It also provides the overview and forecast for the global embedded die packaging technology market based on all the segmentation provided with respect to four major regions—North America, Europe, Asia Pacific, and Rest of the World.

Also, primary interviews were conducted with industry participants and commentators to validate data as well as to gain more analytical insights into the topic. Participants of this process include industry experts, such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants, such as valuation experts, research analysts, and key opinion leaders specializing in the embedded die packaging technology market.

ASE Group; Microsemi; General Electric Company; Taiwan Semiconductor Manufacturing Company, Limited; Fujikura Ltd.; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; Amkor Technology, Inc.; Infineon Technologies Ag, and AT & S Austria Technologie & Systemtechnik Aktiengesellschaft are among the key players that are profiled during this market study. In addition to these players, several other essential market players from the entire value chain have also been studied and analyzed to get a holistic view of the global embedded die packaging technology market and its ecosystem.
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